串行外设接口 ( SPI )
| Product |
Volume P |
Descript |
Operatin |
Interface |
Max. Bus |
Packages |
| MCP23016 |
1.13 |
16-bit I |
2.0 - 5.5 |
I²C™ |
400 |
28/QFN， 28/SOIC 300mil， 28/SPDIP， 28/SSOP 208mil |
| MCP23017 |
0.85 |
16-bit I |
1.8 - 5.5 |
I²C™ |
1700 |
28/QFN， 28/SOIC 300mil， 28/SPDIP， 28/SSOP 208mil |
| MCP23S17 |
0.9 |
16-bit I |
1.8 - 5.5 |
SPI |
10000 |
28/QFN， 28/SOIC 300mil， 28/SPDIP， 28/SSOP 208mil |
| MCP2030 |
1.58 |
3-axis R |
2 - 3.6 |
SPI |
125 |
14/PDIP， 14/SOIC 150mil， 14/TSSOP |
| MCP23008 |
0.74 |
8-bit I/ |
1.8 - 5.5 |
I²C™ |
1700 |
18/PDIP， 18/SOIC 300mil， 20/QFN， 20/SSOP 208mil |
| MCP23S08 |
0.77 |
8-bit I/ |
1.8 - 5.5 |
SPI |
10000 |
18/PDIP， 18/SOIC 300mil， 20/QFN， 20/SSOP 208mil |
6 of 6 Serial Peripherals Devices are listed.
