The AUP family is TI’s premier solution to the industry’s low-power needs in battery-powered portable applications. This family ensures a very low static and dynamic power consumption across the entire VCC range of 0.8 V to 3.6 V resulting in an increased battery life. This product also maintains excellent signal integrity (see Figure 1 and Figure 2).
This single buffer gate performs the Boolean function Y = A in positive logic.
NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down
| SN74AUP1G34 | |
| Pin/Package | 5SC70 |
| Operating Temperature Range(°C) | -40 to 85 |
| IOL(mA) | 4 |
| IOH(mA) | -4 |
| Vcc max(V) | 3.6 |
| Technology Family | AUP |
| Vcc min(V) | 0.8 |
| Approx. Price (US$) | 0.13 | 1ku |
| No. of Gates | 1 |
| tpd max(ns) | 3.8 |
| ICC(uA) | 0.5 |
| Rating | Catalog |
| 器件 | 状态 | 温度 | 价格（美元） | 封装 | 引脚 | 封装数量 | 封装载体 | 丝印标记 |
| SN74AUP1G34DCKR | ACTIVE | -40 to 85 | 1.60 | 1ku | SC70 (DCK) | 5 | 3000 | LARGE T&R | H9R |
| SN74AUP1G34DCKRG4 | ACTIVE | -40 to 85 | 1.60 | 1ku | SC70 (DCK) | 5 | 3000 | LARGE T&R | H9R |
| 器件 | 环保计划* | 铅/焊球涂层 | MSL 等级/回流焊峰 | 环保信息与无铅 (Pb-free) | DPPM / MTBF / FIT 率 |
| SN74AUP1G34DCKR | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-2-260C-1 YEAR | SN74AUP1G34DCKR | SN74AUP1G34DCKR |
| SN74AUP1G34DCKRG4 | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-2-260C-1 YEAR | SN74AUP1G34DCKRG4 | SN74AUP1G34DCKRG4 |
