MDP 01, 03, 05 Thick Film Resistor Networks, Dual-In-Line, Molded DIP
技术特性
- Isolated, bussed and dual terminator schematics available
- 0.160" (4.06 mm) maximum seated height and rugged, molded case construction
- Thick film resistive elements
Datasheet
Application Notes
Counterfeit Statement
General Information
Lead Free
Ordering Info
Product Literature
Reference Data