DFP Thick Film Resistor Networks, Flat Pack
技术特性
- Isolated and bussed schematics available
- 0.065" (1.65 mm) height for high density packaging
- Low temperature coefficient (- 55 °C to + 125 °C) ± 100 ppm/°C
Datasheet
Counterfeit Statement
General Information
- Surface Mount Soldering - Film Resistor Division Products Recommended for Thick Film Chip and Resistor Network Styles
Lead Free
Ordering Info
Packaging Information
Product Literature