OSOP Molded, 25 mil Pitch, Dual-In-Line Thin Film Resistor, Surface Mount Network
技术特性
- 0.068" (1.73 mm) maximum seated height
- Rugged molded case construction with no internal solder
- JEDEC MO-137 variation AD
Datasheet
Approval Documents
- Certificate - ISO 9001 Certificate of Registration
- Certification - ISO 14001 Certification of Registration
General Information
- General Information - 2009 Review of Thin Film North America Products (Vishay Thin Film, Vishay Electro-Films)
- Land Patterns - Vishay Dale Thin Film Land Patterns
Lead Free
- Lead-Free Family Summary Sheet - Resistor Components - Resistor and Plasma Display Lead-Free Product Family-2011
Product Literature
- Capabilities - Thin Film Resistor Networks - Precision Thin Film Technology
- Product Overview - Precision Thin Film Technology
- Product Sheet - Quick-Net® Thin Film Precision Resistor Networks
Tape and Reel Info
- Tape and Reel Specifications - 8 mm, 12 mm, 16 mm and 24 mm Embossed Conductive Tape Conforming to EIA-481
- OSOP 60002
- Certificate 60013
- Certification 60033
- General Information 61053
- Land Patterns 60013
- Lead-Free Family Summary Sheet - Resistor Components 60013
- Capabilities 60013
- Product Overview 60013
- Product Sheet 60013
- Tape and Reel Specifications 60013
- OSOP Molded, 25 mil Pitch, Dual-In-Line Thin Film Resistor, Surface Mount Network 60002
