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M High Reliability Thick Film Resistor, Surface Mount Chip

技术特性

• High purity alumina substrate for high power dissipation (2 W max.)
• Wraparound terminations featuring a thin film adhesion layer covered with a leach resistant nickel barrier layer for +150 °C operating conditions
• High speed laser trimming for high volume requirements

Datasheet

• M

General Information

• Land Patterns - Vishay Dale Thin Film Land Patterns

Lead Free

• Lead-Free Family Summary Sheet - Resistor Components - Resistor and Plasma Display Lead-Free Product Family-2011

Packaging Information

• Waffle Pack Packaging - Waffle Pack Packaging

Product Literature

• Instructional Guide - Resistors 101 - Instructional Guide
• Selector Guide - Vishay Dale Thin Film Chip Overview: Resistive Solutions for a Wide Range of Industries

Tape and Reel Info

• Tape and Reel Specifications - 8 mm, 12 mm, 16 mm and 24 mm Embossed Conductive Tape Conforming to EIA-481

Technical Notes

• 技术说明 - 线性固定电阻器的脉冲载荷处理 - Pulse Load Handling for Fixed Linear Resistors
• Technical Note - Drift Calculation for Thin Film Resistors
• Technical Note - Drift Calculation for Thin Film Resistors
• Technical Note - Pulse Load Handling for Fixed Linear Resistors
• Technical Note - Pulse Load Handling for Fixed Linear Resistors
• Technical Note - Vishay Thin Film Lead Free Wraparound Process

Technical Papers

• Capacitor Technologies in a Solar Inverter - Selecting Capacitors for the Energy Buffer in Solar Inverters