TSP Molded, Commercial, Single In-Line Thin Film Resistor, Through Hole Network (Standard)
技术特性
- Lead (Pb)-free gold plated terminals standard
- Gold to gold terminations (no internal solder)
- Exceptional ratio stability over time and temperature (ΔR ± 0.015 % 2000 h at 70 °C)
Datasheet
Approval Documents
- Certificate - ISO 9001 Certificate of Registration
- Certification - ISO 14001 Certification of Registration
General Information
- Land Patterns - Vishay Dale Thin Film Land Patterns
Lead Free
- Lead-Free Family Summary Sheet - Resistor Components - Resistor and Plasma Display Lead-Free Product Family-2011
Product Literature
- Capabilities - Thin Film Resistor Networks - Precision Thin Film Technology
- Product Overview - Precision Thin Film Technology
- Product Sheet - Quick-Net® Thin Film Precision Resistor Networks
- TSP 60037
- Certificate 60013
- Certification 60033
- Land Patterns 60013
- Lead-Free Family Summary Sheet - Resistor Components 60013
- Capabilities 60013
- Product Overview 60013
- Product Sheet 60013
- TSP Molded, Commercial, Single In-Line Thin Film Resistor, Through Hole Network (Standard) 60037
