CSOM Sandwich, 25 mil Pitch, Dual In-Line Thin Film Resistor, Surface Mount Network
技术特性
- Lead (Pb)-free gold plated terminals standard
- Gold-to-gold terminations. External leads are attached directly to gold pads on the ceramic substrate by thermo-compression bonding (no internal solder)
- Tighter tolerances than molded standards (0.01 %)
Datasheet
- CSOM 60121
