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Hybrid Circuit Substrates High-Power Multi-Tiered Conductor Hybrid Circuit Substrate

技术特性

• Copper power lines up to 5000 microinches thick
• Gold small signal lines ± 100 microinches width tolerance
• Temperatures to 350 °C

Datasheet

• Hybrid Circuit Substrates

Application Notes

• Application Note - Cost-effective High Volume Interconnect Thin Film Substrate Solutions

General Information

• General Information - 2009 Review of Thin Film North America Products (Vishay Thin Film, Vishay Electro-Films)

Product Literature

• Capabilities - AuSn Series - Thin Film Patterned Substrates with Deposited Gold/Tin Pads
• Capabilities Brochure - Diode Submount Capabilities Using Thin Film Substrates
• Capabilities Brochure - Pattern Substrates Using Thin Film Technology: Vishay Electro-Films Application-Specific Pattern Substrates
• Product Sheet - Model HDI: High-Density Interconnects

Reference Data

• Application Note - Application of High Conductivity Traces in Thin Film
• Characteristics & Capabilities - Patterned Substrate Products
• Technical Note - Substrate Design Guidelines

Technical Notes

• Technical Note - An Introduction to Substrate PIMIC Technology
• Technical Note - Applications and Design of Plated and Filled Via Circuits
• Technical Note - Thin Film High-Density Integration (HDI) Design Guidelines