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SQM50P08-25L Automotive P-Channel 80 V (D-S) 175 °C MOSFET

技术特性

• TrenchFET® Power MOSFET
• Package with Low Thermal Resistance
• 100 % Rg and UIS Tested

Datasheet

• SQM50P08-25L

Markings

• Part Marking Information - devices: TO-220, TO-262, TO-263 (D2PAK, D2PAK-5)

Ordering Info

• Ordering Information - D2PAK / TO-263 and TO-262

Package Drawings

• Package Information - TO-263 (D2PAK): 3-LEAD

Pad Guidelines

• PAD Pattern - D2PAK

RC Thermal Models

• SQM50P08-25L_RC - R-C Thermal Model Parameters
• SUA70060E_RC - R-C Thermal Model Parameters

Reel Info

• Reel Information - Reel

Reliability Data

• Package Reliability - Environmental and Package Testing Data for D2PAK (TO-263), TO-220
• Silicon Technology Reliability - P-Channel - Automotive Accelerated Operating Life Test Result

Tape Info

• 90-2342-x - TO-263 (D2PAK): 3- and 5-lead
• PACK-0020- - Device Orientation for TO-263 (T1)

SPICE Models (*.pdf)

• Si8406DB-DS - DS-SPICE Model for Si8406DB
• SQM50P08-25L-DS - SPICE Model for SQM50P08-25L

SPICE Models (*.zip)

• Si8406DB-zip - SPICE Models for Si8406DB
• SQM50P08-25L-zip - SPICE Models for SQM50P08-25L