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SiHD7N60E E Series Power MOSFET

技术特性

• Low figure-of-merit (FOM) Ron x Qg
• Low input capacitance (Ciss)
• Reduced switching and conduction losses

Datasheet

• SiHD7N60E

Application Notes

• System Application Note AN848 - Two-Switch Forward Converter: Operation, FOM, and MOSFET Selection Guide

General Information

• General Information - Useful Web Links

Package Drawings

• Package Information - TO-252AA (High Voltage)
• Package Information - TO-252AA Case Outline

Pad Guidelines

• Application Note 826 - RECOMMENDED MINIMUM PADS FOR DPAK (TO-252)

RC Thermal Models

• SiHD7N60E_RC - R-C Thermal Model Parameters

Reel Info

• Reel Information - DPAK Reel

Reliability Data

• Package Reliability - Environmental and Package Testing Data for DPAK (TO-252), IPAK (HVM)
• Silicon Technology Reliability - N-Channel Accelerated Operating Life Test Result

Tape Info

• 90-2339-1 - Tape Drawing for TO-252 (DPAK) (T1 Method)
• 90-2369-x - Tape Drawing for TO-252 (DPAK) (T4 Method)
• Device Orientation - Device Orientation for TO-252 and TO-263 (T5)
• Tape Information - Carrier Tape for DPAK TE1 and TE2
• Tape Information - Carrier Tape for DPAK TE3

SPICE Models (*.pdf)

• SiHD7N60E-DS - E Series Power MOSFET

SPICE Models (*.zip)

• SiHD7N60E-zip - SPICE Models for SiHD7N60E