3B18:  Non-Isolated Strain Gage Input; 20 kHz Bandwidth Signal Conditioning Module

The 3B Series Signal Conditioning I/O Subsystem provides a low cost, versatile method of interconnecting real world analog signals to a data acquisition, monitoring or control system. It is designed to interface directly to analog signals such as thermocouple, RTD, ac and dc Strain Gage, Torque Transducer, Frequency, LVDT, AD590/AC2626 solid state temperature sensor outputs, and millivolt or process current signals, and convert the inputs to standardized analog outputs compatible with high level analog I/O subsystems.

The 3B Series Subsystem consists of a 19" relay rack, compatible universal mounting backplane and a family of plug-in input and output signal conditioning modules (up to 16 per rack). 8- and 4-channel backplanes are also available. Each backplane incorporates screw terminals for sensor inputs and current outputs and a connector for high level, single-ended outputs to the user’s equipment.

Input and output modules are offered in both isolated (±1500 V peak) and nonisolated versions. The input modules feature complete signal conditioning circuitry optimized for specific sensors or analog signals, and provide high level analog outputs. Each input module provides two simultaneous outputs: 0 V to +10 V (or ±10 V) and 4–20 mA (or 0–20 mA). Output modules accept 0 V to +10 V (or ±10 V) single ended signals and provide an isolated or nonisolated 4–20 mA (or 0–20 mA) process signal. All modules feature a universal pinout and may be readily “mixed and matched” and interchanged without disrupting field wiring.

Each backplane contains the provision for a subsystem power supply. The 3B Series Subsystem can operate either from a common dc/dc or ac power supply mounted on each backplane, or from externally provided dc power. Two LEDs are used to indicate that power is being applied.

特点和优势
  • Accepts Strain Gage Input
  • Selectable Bridge Excitation (+3.3V or +10V)
  • 10KHz BW
  • Voltage (± 10V) and Current Outputs(0-20mA or 4-20mA)
Functional Block Diagram for 3B18
Functional Block Diagram for 3B18
3B18 产品订购信息
产品型号封装引脚温度范围包装和数量报价RoHS查看PCN/PDN
3B18-00 产品状态: 量产IOS MODULE30商业Tray, 1-N  材料信息
3B18-01 产品状态: 量产IOS MODULE30商业Tray, 1-N  材料信息
3B18-02 产品状态: 量产IOS MODULE30商业Tray, 1-N  材料信息
3B18-CUSTOM 产品状态: 量产IOS MODULE30商业Tray, 1-N  材料信息
技术资料
标题内容
3B18: Wide Bandwidth Strain Gage Input Data Sheet (Rev 0, 01/1999)产品数据手册
AN-535: Digital Input/Output Subsystems应用笔记
AN-349: 延长CMOS寿命的关键因素应用笔记
AN-349: Keys to Longer Life for CMOS应用笔记
3B User's Manual用户指导
IOS 3 Year Warranty概况
3B Series Overviews概况
IOS Short Form Brochure概况
3B18: Wide Bandwidth Strain Gage Input Data Sheet (Rev 0, 01/1999) 3B18
Functional Block Diagram for 3B18 3B18
AN-535: Digital Input/Output Subsystems 3B17
AN-349: 延长CMOS寿命的关键因素 adg3233
AN-349: Keys to Longer Life for CMOS ad7703
3B Series User Manual 3B17
IOS 3 Year Warranty AC2626
IOS Short Form Brochure 1B22