特点- 高亮度InGaN 材料
- 体积小，厚度极低
- 0603 工业标准引脚，上层发光套件的高度为 0.35 毫米
- 扩散型光学器件
- 适于采用红外回流焊工艺
- 可在 7 英寸直径的卷轴上镶嵌 8 毫米导电胶带
- 卷轴封存在防潮自封袋内
Applications- 薄膜开关指示灯
- LCD 背光照明
- 按钮背光照明
- 前面板指示器
- 符号背光照明
- 键盘背光照明
| | Specification | Value |
|---|
| Lifecycle | Active | | Distrib. Inventory | Yes | | Dimension Lxwxh In Mm | 1.6 x 0.8 x 0.35 | | Intensity Bin Selection | Open | | RoHS6 Compliant | Y | | Led Chip Type | InGaN | | Max Qty of Samples | 20 | | Minimum Luminous Intensity (mcd) | 18.0 | | Mounting Direction | Top | | Mounting Method | Surface Mount | | Package | Top Mount Very Low Profile | | Test Current (mA) | 20.0 | | Typical Forward Voltage In V | 3.4 | | Typical Dominant Wavelength (nm) | 527 | | Typical Luminous Intensity (mcd) | 55 | | Viewing Angle (degree) | 145° |
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