CYWB0226ABS-BVXIT
CYWB0226ABS-BVXIT| Development Kit | CYWBDVK002AB |
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| Automotive Qualified | N |
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| Clock Input Frequency (MHz) | 19.2, 24, 26, 48 |
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| Interfaces Supported | HS-USB, SD/MMC+ |
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| Max. Operating Temp. (°C) | 85 |
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| Max. Operating Voltage (V) | 3.30 |
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| Min. Operating Temp. (°C) | -40 |
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| Min. Operating Voltage (V) | 1.80 |
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| Tape & Reel | Y |
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Pricing & Inventory Availability| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
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| $15.36 | $13.27 | $12.57 | $10.48 | $10.17 | $9.47 |
- Carrier Drawing
- 001-91392.pdf English , 05/06/2014
- 001-04710.pdf English , 10/04/2012
- 51-51153.pdf English , 03/06/2012
- Package Material Declaration
- 100-VFBGA 6X6X1.0MM PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET.pdf English , 12/01/2016
- Product Change Notice
- PCN125145.zip English , 06/07/2012
- Product Information Notice
- PIN145281.zip English , 03/20/2014
- Qualification Reports
- 071202 rev 1 0 100 VFBGA MSL3 260C AIT-Indonesia.pdf English , 04/21/2009
- 053408 rev 1.0 7C84400A, L8C-3R, Fab4.pdf English , 04/21/2009
- 061701 rev 3.0 32L QFN, Low Profile, MSL3, 260C, CML-RA.pdf English , 04/21/2009
- 053102 rev. 3.0 44Llead,TSOPII,NiPdAu,260C, CML-R.pdf English , 04/21/2009
- QTP 42801 48/56/100-Ball VFBGA (6 x 8 x 1.0mm), (5 x 5 x 1.0mm), (6 x 6 x 1.0mm) MSL3, 260C Solder Reflow Cypress Philippines (CML-RA).pdf English , 08/07/2015
- QTP# 112212 60-BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP) (3.79 X 3.88 X 0.55 MM) MSL1, 260C AMKOR-TAIWAN (AU/AW).pdf English , 08/07/2015
