ESD101-B1-02ELS

• ESD / transient protection of high speed data lines exceeding: – IEC61000-4-2 (ESD): ±12 kV (contact), ±14 kV (air) • Maximum working voltage: VRWM = ±5.5 V • Ultra low capacitance CL = 0.1 pF I/O to GND (typical) • Very low clamping voltage: VCL= 30 V at IPP = 16 A (typical) • Very low dynamic resistance: RDYN = 1.5 Ω (typical) • Pb-free and halogen-free package (RoHS compliant)

• RF antenna • Super high speed interfaces such as USB 3.0, HDMI 1.4a, MHL

ParametricESD101-B1-02ELS
VRWM  min  max-5.5V  5.5V
CL    (max)0.1pF  (0.2pF)
VESD  min  max-12.0kV  12.0kV
Rdyn (reverse)1.3Ω
Rdyn (forward)1.3Ω
Vcl typ. reverse (TLP 16A)29
Vcl typ. forward (TLP 16A)29
IR  max50.0µA
Protected Lines1
Sales Product NameESD101-B1-02ELS
OPNESD101B102ELSE6327XTSA1
Product Statusactive
Package NamePG-TSSLP-2
Completely lead freeyes
Halogen freeyes
RoHS compliantyes
Packing Size15000
Packing TypeTAPE & REEL
Moisture Level1
Data Sheet
TitleSizeDateVersion
ESD101-B1-02series,EN657 KB30 七月 201501_03
Application Notes
TitleSizeDateVersion
AN327613 KB28 五月 201301_00
Material Content SheetInfo
TitleSizeDateVersion
Infineon-MA001482194-MCDS-v01_00-ENEN27 KB17 三月 201601_00
MCDS_2013-08-29_12-23-29_MA001101872_PG-TSSLP-2-4.pdf23 KB31 十月 201301_00
PCB Design Data
TitleSizeDateVersion
Infineon-PCB Footprints and Symbols ESD101-B1-02ELS Low Capacitance ESD Devices Eagle v1zip-PCB-v01_00-ENEN2 KB17 三月 201601_00
Infineon-PCB Footprints and Symbols ESD101-B1-02ELS Low Capacitance ESD Devices Cadence v1zip-PCB-v01_00-ENEN10 KB17 三月 201601_00
Infineon-PCB Footprints and Symbols ESD101-B1-02ELS Low Capacitance ESD Devices Altium v1zip-PCB-v01_00-ENEN457 KB17 三月 201601_00
Infineon-PCB Footprints and Symbols ESD101-B1-02ELS Low Capacitance ESD Devices Mentor v1zip-PCB-v01_00-ENEN2 KB17 三月 201601_00
Evaluation Boards
BoardFamilyDescriptionStatus
EVAL ESD101-B1-02ELSESD Low Capacitance DevicesESD101-B1-02ELSon request
Simulation Models
TitleSizeDateVersion
Infineon-TVS-Keysight_ADS_Design_Kit-SM-v02_10-ENEN951 KB31 一月 201602_10
Infineon-TVS-AWR_MWO_Design_Kit-SM-v02_10-ENEN681 KB31 一月 201602_10
Infineon-TVS-SPICE-SM-v02_10-ENEN153 KB31 一月 201602_10
Package Data
TitleSizeDateVersion
PG-TSSLP-2-3 | ESD101B102ELSE6327XTSA1EN492 KB11 四月 201601_00
PCB Design Data
TitleSizeDateVersion
Infineon-PCB Footprints and Symbols ESD101-B1-02ELS Low Capacitance ESD Devices Eagle v1zip-PCB-v01_00-ENEN2 KB17 三月 201601_00
Infineon-PCB Footprints and Symbols ESD101-B1-02ELS Low Capacitance ESD Devices Cadence v1zip-PCB-v01_00-ENEN10 KB17 三月 201601_00
Infineon-PCB Footprints and Symbols ESD101-B1-02ELS Low Capacitance ESD Devices Altium v1zip-PCB-v01_00-ENEN457 KB17 三月 201601_00
Infineon-PCB Footprints and Symbols ESD101-B1-02ELS Low Capacitance ESD Devices Mentor v1zip-PCB-v01_00-ENEN2 KB17 三月 201601_00
EN ESD101-B1-02ELS
AN327 ESD103-B1-02ELS
EN ESD101-B1-02ELS
MCDS_2013-08-29_12-23-29_MA001101872_PG-TSSLP-2-4.pdf ESD101-B1-02ELS
EN ESD307-U1-02N
EN ESD307-U1-02N
EN ESD307-U1-02N
EN ESD101-B1-02ELS
EN ESD101-B1-02ELS
EN ESD101-B1-02ELS
EN ESD101-B1-02ELS
EN ESD101-B1-02ELS