F3L75R12W1H3_B27

EasyPACK 1B 1200V 3-level phase leg IGBT module with "Neutral Point Clamp 2" topology, NTC, High Speed IGBT H3 and PressFIT Contact Technology

ParametricF3L75R12W1H3_B27
Configuration3-level
IC(nom) / IF(nom)75.0A
VCE(sat) (Tvj=25°C typ)1.45V
VF (Tvj=25°C typ)1.85V
HousingEasyPACK 1B
Sales Product NameF3L75R12W1H3_B27
OPNF3L75R12W1H3B27BOMA1
Product Statusactive and preferred
Package NameAG-EASY1B-2
Completely lead freeno
Halogen freeno
RoHS compliantyes
Packing Size24
Packing TypeTRAY
Summary of Features:
  • High Speed IGBT H3
  • Low inductive design
  • Low Switching Losses
  • Compact design
  • PressFIT Contact Technology
  • Rugged mounting due to integrated mounting clamps
Benefits:
  • Compact module concept
  • Optimized customer’s development cycle time and cost
  • Configuration flexibility
Benefits:
  • Compact module concept
  • Optimized customer’s development cycle time and cost
  • Configuration flexibility
功能框图
Data Sheet
TitleSizeDateVersion
F3L75R12W1H3_B27 (chinese/english),CN/EN,EN/DE,JA/EN1.3 MB05 四月 201603_02
Product Brochure
TitleSizeDateVersion
Best-in-class products to meet your application demands；EN1.3 MB27 四月 201608_00
1EDI EiceDRIVER™ Compact 300 mil；EN216 KB09 五月 201601_00
Product Brochure Industrial Gate Driver ICs Overview；EN613 KB27 四月 201603_00
Application Notes
TitleSizeDateVersion
利用单极栅电压驱动IGBT；CN；EN384 KB03 十一月 201501_00
Industrial IGBT Modules Explanation of Technical Information；EN；JA2.2 MB03 十二月 201501_02
等效热路模型；CN；EN；DE500 KB25 十一月 2013
Application Note IGBT Definition of Junction Temperature；EN84 KB09 四月 2009
如何正确计算并最大限度减小 IGBT 的死区时间；CN；EN1.5 MB26 八月 2013
Application of screen print templates to paste thermal grease within IGBT modules；EN489 KB10 二月 2014
Aging stability of various heatconducting pastes for use with modules without baseplates；EN111 KB10 二月 2014
Series connection of IGBTs；EN28 KB10 二月 2014
Paralleling of IGBTs；EN28 KB10 二月 2014
电力电子模块内部NTC的使用；CN；EN586 KB26 十一月 2013
Assembly Instructions - Easy-PressFIT Modules；EN1.5 MB29 四月 201302_02
Product Brief
TitleSizeDateVersion
Easy & Econo 模块；CN；EN588 KB25 十一月 2013
EasyB-系列模块 与Easy750；CN；EN524 KB25 十一月 2013
3-Level Inverter Modules；EN307 KB27 四月 201608_00
PressFIT - Our established, reliable mounting technology；EN616 KB27 四月 201608_00
Modules for Photo Voltaic String and Multi-String Inverters；EN476 KB27 四月 201604_00
Editorials
TitleSizeDateVersion
Correlating NTC-Reading and Chip-Temperature in Power Electronic Modules；EN297 KB04 十一月 201501_00
Thermal Heat Sink Interface of IGBT Modules w/o Base Plate；EN384 KB07 二月 2014
Reliability of PressFIT connections；EN472 KB06 六月 2008
PressFIT Technology, a Solderless Method for Mounting Power Modules；EN377 KB12 二月 2014
The challenge of accurately analyzing thermal resistances；EN1.1 MB31 五月 2014
System Benefits for Solar Inverters using SiC Semiconductor Modules；EN676 KB17 七月 2014
Application Brochure
TitleSizeDateVersion
Solutions for Industrial Drives；EN2.4 MB27 四月 201609_00
Solutions for Uninterruptible Power Supply (UPS) Systems；EN2.6 MB27 四月 201608_00
Solutions for Solar Energy Systems；EN1.9 MB26 六月 201401_00
Product Catalogue
TitleSizeDateVersion
Short Form Catalog - May 2016；EN4.4 MB09 五月 201601_00
Material Content Data Sheet
TitleSizeDateVersion
MCDS - Easy1-B；EN38 KB06 一月 201403_00
Evaluation Boards
BoardFamilyDescriptionStatus
2ED300E17-SFOGate Driver, IGBT ModulesThis evaluation board for the 2ED300C17-S / -ST IGBT driver boards can be used for all medium and high power IGBT modules up to 1700V.For equipping EiceDRIVER™ 2ED300C17-S / -STon request
2ED300C17-SIGBT Modules up to 1700VEiceDRIVER™ Safe - Dual channel IGBT gate driver board with reinforced isolationFor driving IGBT modules up to 1700Vactive and preferred
2ED300C17-STIGBT Modules up to 1700VEiceDRIVER™ Safe - Dual channel IGBT gate driver board with reinforced isolationFor driving IGBT modules up to 1700Vactive and preferred
Simulation Models
TitleSizeDateVersion
IPOSIM；EN3.4 MB18 三月 2014
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