FF1800R17IP5

1700V PrimePACK™3+ dual IGBT module with IGBT5 and .XT interconnection technology, Trench/Fieldstop IGBT5, Emitter Controlled 5 diode and NTC.

ParametricFF1800R17IP5
ConfigurationDual
IC(nom) / IF(nom)1800.0A
VCE(sat) (Tvj=25°C typ)1.75V
VF (Tvj=25°C typ)1.75V
HousingPrimePACK™ 3+
Sales Product NameFF1800R17IP5
OPNFF1800R17IP5BPSA1
Product Statusactive and preferred
Package NameAG-PRIME3+-5
Completely lead freeno
Halogen freeno
RoHS compliantyes
Packing Size2
Packing TypeTRAY
Summary of Features:
  • Extended Operation Temperature (Tvjop= 175°C)
  • Output current increased by more than 25% in the same footprint
  • Copper Bonds for high current carrying capabilities
  • Sintering of chips for highest power cycling capabilities
  • Total losses reduced by up to 20%
  • Package with CTI > 400
Benefits:
  • Increase in Power Density by up to 25%
  • Up to 10 times longer lifetime
  • Less cooling effort for same output power
  • Enables higher system overload conditions
Benefits:
  • Increase in Power Density by up to 25%
  • Up to 10 times longer lifetime
  • Less cooling effort for same output power
  • Enables higher system overload conditions
功能框图
Data Sheet
TitleSizeDateVersion
FF1800R17IP5 (chinese/english),CN/EN,EN/DE,JA/EN1 MB06 六月 201603_01
Product Brochure
TitleSizeDateVersion
Product Brochure Industrial Gate Driver ICs Overview；EN613 KB27 四月 201603_00
Best-in-class products to meet your application demands；EN1.3 MB27 四月 201608_00
Application Notes
TitleSizeDateVersion
电力电子模块内部NTC的使用；CN；EN586 KB26 十一月 2013
等效热路模型；CN；EN；DE500 KB25 十一月 2013
Industrial IGBT Modules Explanation of Technical Information；EN；JA2.2 MB03 十二月 201501_02
PrimePACK™ 模块的安装说明；CN；EN645 KB25 十一月 2013
如何正确计算并最大限度减小 IGBT 的死区时间；CN；EN1.5 MB26 八月 2013
Application of screen print templates to paste thermal grease within IGBT modules；EN489 KB10 二月 2014
Series connection of IGBTs；EN28 KB10 二月 2014
Application Note IGBT Definition of Junction Temperature；EN84 KB09 四月 2009
Paralleling of IGBTs；EN28 KB10 二月 2014
Aging stability of various heatconducting pastes for use with modules without baseplates；EN111 KB10 二月 2014
Product Brief
TitleSizeDateVersion
IHM, IHV Modules & PrimePACK™；EN452 KB27 四月 201608_00
PrimePACK™ with IGBT5 and .XT - The Dawning of a New Era；EN283 KB27 四月 201602_00
Article
TitleSizeDateVersion
The Influence of IGBT5 and .XT - Bodos Power；EN537 KB18 五月 201601_00
Vervielfachung von Lebensdauer und Leistungsdichte mit IGBT5 & .XT；DE286 KB13 十月 201501_00
Enhanced Module Design Makes Most of New IGBT5 Performance；EN367 KB13 十月 201501_00
Höhere Stromdichten bei unverändertem Bauraum；DE3.2 MB13 十月 201501_00
Infineon-More Power by IGBT5 with .XT-ART-v01_00-EN；EN410 KB06 五月 201501_00
Editorials
TitleSizeDateVersion
New PrimePACK™ package to lever IGBT5；EN344 KB04 十一月 201501_00
End-of-life investigation on the .XT interconnect technology；EN908 KB04 十一月 201501_00
Application Brochure
TitleSizeDateVersion
Solutions for construction, commercial and agricultural vehicles (CAV)；EN6.7 MB30 七月 2014
Solutions for Industrial Drives；EN2.4 MB27 四月 201609_00
Solutions for Traction Systems；EN1.5 MB27 四月 201608_00
Product Catalogue
TitleSizeDateVersion
Short Form Catalog - May 2016；EN4.4 MB09 五月 201601_00
Simulation Models
TitleSizeDateVersion
IPOSIM；EN3.4 MB18 三月 2014
CN/EN FF1800R17IP5
EN/DE FF1800R17IP5
JA/EN FF1800R17IP5
EN 2EDN7524G
EN IFS75B12N3E4_B32
CN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
CN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
DE IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
JA IFS75B12N3E4_B32
CN FF1400R17IP4
EN FF1400R17IP4
CN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN TDB6HK360N16P
EN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN MA401E17
EN FF1800R17IP5
EN FF1800R17IP5
DE FF1800R17IP5
EN FF1800R17IP5
DE FF1800R17IP5
EN FF1800R17IP5
EN FF1800R17IP5
EN FF1800R17IP5
EN XMC4500-E144X1024+AC
EN IFS75B12N3E4_B32
EN 2ED300C17-ST
EN IDV20E65D1
EN IFS75B12N3E4_B32
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