FF650R17IE4V

1700V PrimePACK™2 dual IGBT module especially developed for CAV applications. Including IGBT4 and NTC.

ParametricFF650R17IE4V
ConfigurationDual
IC(nom) / IF(nom)650.0A
VCE(sat) (Tvj=25°C typ)2.0V
VF (Tvj=25°C typ)1.85V
HousingPrimePACK™ 2
Sales Product NameFF650R17IE4V
OPNFF650R17IE4VBOSA1
Product Statusactive and preferred
Package NameAG-PRIME2-1
Completely lead freeno
Halogen freeno
RoHS compliantyes
Packing Size3
Packing TypeTRAY
Summary of Features:
  • Vibration robustness up to 15g
  • Extended Operation Temperature T(tvj op)
  • High DC Stability
  • High Current Density
  • Low Switching Losses
  • V(vj op) = 150°C
  • Low V(cesat)
  • Package with CTI > 400
  • High Creepage and Clearance Distances
  • High Power and Thermal Cycling Capability
  • Copper Base Plate
  • UL recognized
Benefits:
  • Increased load cycle capability
  • Robust against hazardous conditions
  • High ruggedness against vibrations and shock
  • Electric drives outperform hydraulics
Benefits:
  • Increased load cycle capability
  • Robust against hazardous conditions
  • High ruggedness against vibrations and shock
  • Electric drives outperform hydraulics
功能框图
Data Sheet
TitleSizeDateVersion
FF650R17IE4V (chinese/english),EN/CN,EN/DE,EN/JA1.9 MB13 五月 201402_00
Product Brochure
TitleSizeDateVersion
Product Brochure Industrial Gate Driver ICs Overview；EN613 KB27 四月 201603_00
Best-in-class products to meet your application demands；EN1.3 MB27 四月 201608_00
Application Notes
TitleSizeDateVersion
Industrial IGBT Modules Explanation of Technical Information；EN；JA2.2 MB03 十二月 201501_02
利用单极栅电压驱动IGBT；CN；EN384 KB03 十一月 201501_00
等效热路模型；CN；EN；DE500 KB25 十一月 2013
Application Note IGBT Definition of Junction Temperature；EN84 KB09 四月 2009
如何正确计算并最大限度减小 IGBT 的死区时间；CN；EN1.5 MB26 八月 2013
Application of screen print templates to paste thermal grease within IGBT modules；EN489 KB10 二月 2014
Aging stability of various heatconducting pastes for use with modules without baseplates；EN111 KB10 二月 2014
Series connection of IGBTs；EN28 KB10 二月 2014
Paralleling of IGBTs；EN28 KB10 二月 2014
电力电子模块内部NTC的使用；CN；EN586 KB26 十一月 2013
PrimePACK™ 模块的安装说明；CN；EN645 KB25 十一月 2013
PrimePACK™ IGBT 模块 的适配器板；CN；EN1.6 MB25 十一月 2013
Product Brief
TitleSizeDateVersion
IHM, IHV Modules & PrimePACK™；EN452 KB27 四月 201608_00
Editorials
TitleSizeDateVersion
Correlating NTC-Reading and Chip-Temperature in Power Electronic Modules；EN297 KB04 十一月 201501_00
Properties of a New PrimePACK™ IGBT Module Concept；EN213 KB07 二月 2014
On the loss - softness trade-off: Are different chip versions needed for softness-improvement?；EN731 KB31 一月 2011
1200V IGBT4 -High Power- a new Technology Generation with Optimized Characteristics for High Current Modules；EN141 KB07 二月 2014
Comparison between active and passive thermal cycling stress with respect to substrate solder reliability in IGBT modules with Cu baseplates；EN704 KB31 五月 2014
The challenge of accurately analyzing thermal resistances；EN1.1 MB31 五月 2014
Application Brochure
TitleSizeDateVersion
Solutions for Industrial Drives；EN2.4 MB27 四月 201609_00
Solutions for construction, commercial and agricultural vehicles (CAV)；EN6.7 MB30 七月 2014
Product Catalogue
TitleSizeDateVersion
Short Form Catalog - May 2016；EN4.4 MB09 五月 201601_00
Evaluation Boards
BoardFamilyDescriptionStatus
2ED300E17-SFOGate Driver, IGBT ModulesThis evaluation board for the 2ED300C17-S / -ST IGBT driver boards can be used for all medium and high power IGBT modules up to 1700V.For equipping EiceDRIVER™ 2ED300C17-S / -STon request
2ED300C17-SIGBT Modules up to 1700VEiceDRIVER™ Safe - Dual channel IGBT gate driver board with reinforced isolationFor driving IGBT modules up to 1700Vactive and preferred
2ED300C17-STIGBT Modules up to 1700VEiceDRIVER™ Safe - Dual channel IGBT gate driver board with reinforced isolationFor driving IGBT modules up to 1700Vactive and preferred
MA300E17IGBT ModulesEvaluation Adapter board containing a booster stage for driving 1700V PrimePACK™ in single or parallel configuration. For connecting 1700V PrimePACK™ IGBT Modules and driver boardson request
Simulation Models
TitleSizeDateVersion
IPOSIM；EN3.4 MB18 三月 2014
EN/CN FF650R17IE4V
EN/DE FF650R17IE4V
EN/JA FF650R17IE4V
EN 2EDN7524G
EN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
JA IFS75B12N3E4_B32
CN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
CN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
DE IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
CN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN TDB6HK360N16P
EN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
CN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
CN FF1400R17IP4
EN FF1400R17IP4
CN FF1400R17IP4
EN 2ED300E17-SFO
EN MA401E17
EN DD250S65K3
EN FF1400R17IP4
EN FP75R17N3E4
EN FP75R17N3E4
EN BYM600A170DN2
EN DD250S65K3
EN IFS75B12N3E4_B32
EN XMC4500-E144X1024+AC
EN IDV20E65D1
EN IFS75B12N3E4_B32
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