EconoPACK™ 4 1200V sixpack IGBT module with Trench/Fieldstop IGBT4, Emitter Controlled 4 diode, NTC and PressFIT Contact Technology
Title | Size | Date | Version |
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FS100R12PT4 (chinese/english),EN/CN,EN/DE,EN/JA | 1 MB | 09 十二月 2013 | 02_02 |
Title | Size | Date | Version |
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1EDI EiceDRIVER™ Compact 300 mil;EN | 216 KB | 09 五月 2016 | 01_00 |
Product Brochure Industrial Gate Driver ICs Overview;EN | 613 KB | 27 四月 2016 | 03_00 |
Best-in-class products to meet your application demands;EN | 1.3 MB | 27 四月 2016 | 08_00 |
Title | Size | Date | Version |
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利用单极栅电压驱动IGBT;CN;EN | 384 KB | 03 十一月 2015 | 01_00 |
Industrial IGBT Modules Explanation of Technical Information;EN;JA | 2.2 MB | 03 十二月 2015 | 01_02 |
Soldering of Econo and Easy Modules;EN | 194 KB | 10 二月 2014 | |
安装说明 EconoPACK™4 模块;CN;EN;DE | 1 MB | 20 八月 2012 | |
Application Note IGBT Definition of Junction Temperature;EN | 84 KB | 09 四月 2009 | |
电力电子模块内部NTC的使用;CN;EN | 586 KB | 26 十一月 2013 | |
等效热路模型;CN;EN;DE | 500 KB | 25 十一月 2013 | |
如何正确计算并最大限度减小 IGBT 的死区时间;CN;EN | 1.5 MB | 26 八月 2013 | |
Application of screen print templates to paste thermal grease within IGBT modules;EN | 489 KB | 10 二月 2014 | |
Aging stability of various heatconducting pastes for use with modules without baseplates;EN | 111 KB | 10 二月 2014 | |
Series connection of IGBTs;EN | 28 KB | 10 二月 2014 | |
Paralleling of IGBTs;EN | 28 KB | 10 二月 2014 |
Title | Size | Date | Version |
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EconoDUAL™, EconoPACK™ 4 and EconoPACK™ + Power Modules;EN | 440 KB | 27 四月 2016 | 07_00 |
PressFIT - Our established, reliable mounting technology;EN | 616 KB | 27 四月 2016 | 08_00 |
EconoPACK™4 Power Modules;EN | 106 KB | 27 四月 2016 | 07_00 |
Title | Size | Date | Version |
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Correlating NTC-Reading and Chip-Temperature in Power Electronic Modules;EN | 297 KB | 04 十一月 2015 | 01_00 |
IGBT Module technology state of the art and future evolutions;EN | 37 KB | 07 二月 2014 | |
On the loss - softness trade-off: Are different chip versions needed for softness-improvement?;EN | 731 KB | 31 一月 2011 | |
1200V IGBT4 -High Power- a new Technology Generation with Optimized Characteristics for High Current Modules;EN | 141 KB | 07 二月 2014 | |
Comparison between active and passive thermal cycling stress with respect to substrate solder reliability in IGBT modules with Cu baseplates;EN | 704 KB | 31 五月 2014 | |
The challenge of accurately analyzing thermal resistances;EN | 1.1 MB | 31 五月 2014 |
Title | Size | Date | Version |
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Solutions for Industrial Drives;EN | 2.4 MB | 27 四月 2016 | 09_00 |
Solutions for Uninterruptible Power Supply (UPS) Systems;EN | 2.6 MB | 27 四月 2016 | 08_00 |
Solutions for construction, commercial and agricultural vehicles (CAV);EN | 6.7 MB | 30 七月 2014 |
Title | Size | Date | Version |
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Short Form Catalog - May 2016;EN | 4.4 MB | 09 五月 2016 | 01_00 |
Title | Size | Date | Version |
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MCDS - EconoPACK4;EN | 58 KB | 06 一月 2014 | 03_00 |
Board | Family | Description | Status |
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2ED300E17-SFO | Gate Driver, IGBT Modules | This evaluation board for the 2ED300C17-S / -ST IGBT driver boards can be used for all medium and high power IGBT modules up to 1700V.For equipping EiceDRIVER™ 2ED300C17-S / -ST | on request |
2ED300C17-S | IGBT Modules up to 1700V | EiceDRIVER™ Safe - Dual channel IGBT gate driver board with reinforced isolationFor driving IGBT modules up to 1700V | active and preferred |
2ED300C17-ST | IGBT Modules up to 1700V | EiceDRIVER™ Safe - Dual channel IGBT gate driver board with reinforced isolationFor driving IGBT modules up to 1700V | active and preferred |
Title | Size | Date | Version |
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IPOSIM;EN | 3.4 MB | 18 三月 2014 |
Title | Size | Date | Version |
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FS100R12PT4 | EconoPACK™4 module | AG-ECONO4-1-1;EN | 513 KB | 11 四月 2016 | 01_00 |