FS100R17N3E4

EconoPACK™ 3 1700V sixpack IGBT module with trench/fieldstop IGBT4, Emitter Controlled Diode and NTC

ParametricFS100R17N3E4
ConfigurationSixpack
IC(nom) / IF(nom)100.0A
VCE(sat) (Tvj=25°C typ)1.95V
VF (Tvj=25°C typ)1.8V
HousingEconoPACK™ 3
Sales Product NameFS100R17N3E4
OPNFS100R17N3E4BOSA1
Product Statusactive and preferred
Package NameAG-ECONO3-4
Completely lead freeno
Halogen freeno
RoHS compliantyes
Packing Size10
Packing TypeTRAY
Summary of Features:
  • Extended Operation Temperature Tvj op
  • Low V(CEsat)
  • V(CEsat) with positive Temperature Coefficient
  • Integrated NTC temperature sensor
  • Isolated Base Plate
  • Solder Contact Technology
  • Standard Housing
Benefits:
  • Compact module concept
  • Optimized customer’s development cycle time and cost
  • Configuration flexibility
Benefits:
  • Compact module concept
  • Optimized customer’s development cycle time and cost
  • Configuration flexibility
功能框图
Data Sheet
TitleSizeDateVersion
FS100R17N3E4 (chinese/english),EN/CN,EN/DE,EN/JA929 KB10 十二月 201302_00
Product Brochure
TitleSizeDateVersion
Best-in-class products to meet your application demands；EN1.3 MB27 四月 201608_00
Product Brochure Industrial Gate Driver ICs Overview；EN613 KB27 四月 201603_00
Application Notes
TitleSizeDateVersion
Industrial IGBT Modules Explanation of Technical Information；EN；JA2.2 MB03 十二月 201501_02
利用单极栅电压驱动IGBT；CN；EN384 KB03 十一月 201501_00
Application Note IGBT Definition of Junction Temperature；EN84 KB09 四月 2009
电力电子模块内部NTC的使用；CN；EN586 KB26 十一月 2013
Application of screen print templates to paste thermal grease within IGBT modules；EN489 KB10 二月 2014
等效热路模型；CN；EN；DE500 KB25 十一月 2013
如何正确计算并最大限度减小 IGBT 的死区时间；CN；EN1.5 MB26 八月 2013
Aging stability of various heatconducting pastes for use with modules without baseplates；EN111 KB10 二月 2014
Series connection of IGBTs；EN28 KB10 二月 2014
Paralleling of IGBTs；EN28 KB10 二月 2014
Product Brief
TitleSizeDateVersion
Easy & Econo 模块；CN；EN588 KB25 十一月 2013
Editorials
TitleSizeDateVersion
Correlating NTC-Reading and Chip-Temperature in Power Electronic Modules；EN297 KB04 十一月 201501_00
Comparison between active and passive thermal cycling stress with respect to substrate solder reliability in IGBT modules with Cu baseplates；EN704 KB31 五月 2014
The challenge of accurately analyzing thermal resistances；EN1.1 MB31 五月 2014
Application Brochure
TitleSizeDateVersion
Solutions for Industrial Drives；EN2.4 MB27 四月 201609_00
Solutions for Uninterruptible Power Supply (UPS) Systems；EN2.6 MB27 四月 201608_00
Product Catalogue
TitleSizeDateVersion
Short Form Catalog - May 2016；EN4.4 MB09 五月 201601_00
Material Content Data Sheet
TitleSizeDateVersion
MCDS - Econo3B；EN37 KB06 一月 201403_00
Evaluation Boards
BoardFamilyDescriptionStatus
2ED300E17-SFOGate Driver, IGBT ModulesThis evaluation board for the 2ED300C17-S / -ST IGBT driver boards can be used for all medium and high power IGBT modules up to 1700V.For equipping EiceDRIVER™ 2ED300C17-S / -STon request
2ED300C17-SIGBT Modules up to 1700VEiceDRIVER™ Safe - Dual channel IGBT gate driver board with reinforced isolationFor driving IGBT modules up to 1700Vactive and preferred
2ED300C17-STIGBT Modules up to 1700VEiceDRIVER™ Safe - Dual channel IGBT gate driver board with reinforced isolationFor driving IGBT modules up to 1700Vactive and preferred
Simulation Models
TitleSizeDateVersion
IPOSIM；EN3.4 MB18 三月 2014
Package Data
TitleSizeDateVersion
FS100R17N3E4 | EconoPACK™3 module | AG-ECONO3-4-1；EN411 KB11 四月 201601_00
EN/CN FS100R17N3E4
EN/DE FS100R17N3E4
EN/JA FS100R17N3E4
EN IFS75B12N3E4_B32
EN 2EDN7524G
EN IFS75B12N3E4_B32
JA IFS75B12N3E4_B32
CN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
CN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN TDB6HK360N16P
CN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
DE IFS75B12N3E4_B32
CN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
CN F3L030E07-F-W2
EN F3L030E07-F-W2
EN DD250S65K3
EN BYM600A170DN2
EN DD250S65K3
EN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN IDV20E65D1
EN FS75R17KE3
EN IFS75B12N3E4_B32
EN FS100R17N3E4
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