FS200R12KT4R_B11

EconoPACK™ 3 1200V sixpack IGBT module with fast Trench/Fieldstop IGBT4, NTC and PressFIT Contact Technology

ParametricFS200R12KT4R_B11
ConfigurationSixpack
IC(nom) / IF(nom)200.0A
VCE(sat) (Tvj=25°C typ)1.75V
VF (Tvj=25°C typ)1.7V
HousingEconoPACK™ 3
Sales Product NameFS200R12KT4R_B11
OPNFS200R12KT4RB11BOSA1
Product Statusactive and preferred
Package NameAG-ECONO3-4
Completely lead freeno
Halogen freeno
RoHS compliantyes
Packing Size10
Packing TypeTRAY
Summary of Features:
  • Continious operation power limited to 150A(rms)
  • Low V(CEsat)
  • T(vj op) = 150°C
  • Al(2)O(3) Substrate with Low Thermal Resistance
  • Copper Base Plate
  • Standard Housing
Benefits:
  • Compact module concept
  • Optimized customer’s development cycle time and cost
  • Configuration flexibility
Benefits:
  • Compact module concept
  • Optimized customer’s development cycle time and cost
  • Configuration flexibility
功能框图
Data Sheet
TitleSizeDateVersion
FS200R12KT4R_B11 (chinese/english),EN/CN,EN/DE,EN/JA950 KB09 十二月 201302_01
Product Brochure
TitleSizeDateVersion
Product Brochure Industrial Gate Driver ICs Overview；EN613 KB27 四月 201603_00
Best-in-class products to meet your application demands；EN1.3 MB27 四月 201608_00
1EDI EiceDRIVER™ Compact 300 mil；EN216 KB09 五月 201601_00
Application Notes
TitleSizeDateVersion
Application of screen print templates to paste thermal grease within IGBT modules；EN489 KB10 二月 2014
利用单极栅电压驱动IGBT；CN；EN384 KB03 十一月 201501_00
Industrial IGBT Modules Explanation of Technical Information；EN；JA2.2 MB03 十二月 201501_02
电力电子模块内部NTC的使用；CN；EN586 KB26 十一月 2013
Application Note IGBT Definition of Junction Temperature；EN84 KB09 四月 2009
Mounting instruction for PressFIT with forked pins；EN；DE675 KB04 十二月 2012
等效热路模型；CN；EN；DE500 KB25 十一月 2013
如何正确计算并最大限度减小 IGBT 的死区时间；CN；EN1.5 MB26 八月 2013
Aging stability of various heatconducting pastes for use with modules without baseplates；EN111 KB10 二月 2014
Series connection of IGBTs；EN28 KB10 二月 2014
Paralleling of IGBTs；EN28 KB10 二月 2014
Product Brief
TitleSizeDateVersion
Easy & Econo 模块；CN；EN588 KB25 十一月 2013
PressFIT - Our established, reliable mounting technology；EN616 KB27 四月 201608_00
Editorials
TitleSizeDateVersion
On the loss - softness trade-off: Are different chip versions needed for softness-improvement?；EN731 KB31 一月 2011
Correlating NTC-Reading and Chip-Temperature in Power Electronic Modules；EN297 KB04 十一月 201501_00
Reliability of PressFIT connections；EN472 KB06 六月 2008
1200V IGBT4 -High Power- a new Technology Generation with Optimized Characteristics for High Current Modules；EN141 KB07 二月 2014
PressFIT Technology, a Solderless Method for Mounting Power Modules；EN377 KB12 二月 2014
Improving Efficiency in AC drives: Comparison of Topologies and Device Technologies；EN892 KB31 五月 2014
Comparison between active and passive thermal cycling stress with respect to substrate solder reliability in IGBT modules with Cu baseplates；EN704 KB31 五月 2014
The challenge of accurately analyzing thermal resistances；EN1.1 MB31 五月 2014
Saving money: SiC in UPS applications；EN759 KB31 五月 2014
Application Brochure
TitleSizeDateVersion
Solutions for Industrial Drives；EN2.4 MB27 四月 201609_00
Solutions for Uninterruptible Power Supply (UPS) Systems；EN2.6 MB27 四月 201608_00
Product Catalogue
TitleSizeDateVersion
Short Form Catalog - May 2016；EN4.4 MB09 五月 201601_00
Material Content Data Sheet
TitleSizeDateVersion
MCDS - Econo3B；EN37 KB06 一月 201403_00
Evaluation Boards
BoardFamilyDescriptionStatus
2ED300E17-SFOGate Driver, IGBT ModulesThis evaluation board for the 2ED300C17-S / -ST IGBT driver boards can be used for all medium and high power IGBT modules up to 1700V.For equipping EiceDRIVER™ 2ED300C17-S / -STon request
2ED300C17-SIGBT Modules up to 1700VEiceDRIVER™ Safe - Dual channel IGBT gate driver board with reinforced isolationFor driving IGBT modules up to 1700Vactive and preferred
2ED300C17-STIGBT Modules up to 1700VEiceDRIVER™ Safe - Dual channel IGBT gate driver board with reinforced isolationFor driving IGBT modules up to 1700Vactive and preferred
Simulation Models
TitleSizeDateVersion
IPOSIM；EN3.4 MB18 三月 2014
EN/CN FS200R12KT4R_B11
EN/DE FS200R12KT4R_B11
EN/JA FS200R12KT4R_B11
EN 2EDN7524G
EN IFS75B12N3E4_B32
EN 1EDI60I12AH
EN TDB6HK360N16P
CN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
JA IFS75B12N3E4_B32
CN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN TDB6HK180N16RR_B11
DE TDB6HK180N16RR_B11
CN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
DE IFS75B12N3E4_B32
CN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
CN F3L030E07-F-W2
EN F3L030E07-F-W2
EN TDB6HK180N16RR_B11
EN FP75R17N3E4
EN DD250S65K3
EN FS100R17N3E4_B11
EN FP75R17N3E4
EN FS100R17N3E4_B11
EN FF225R12ME4_B11
EN BYM600A170DN2
EN DD250S65K3
EN sic-modules
EN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN IDV20E65D1
EN FS75R17KE3
EN IFS75B12N3E4_B32
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