FS200R12PT4P

EconoPACK™ 4 1200V sixpack IGBT module with fast Trench/Fieldstop IGBT4, Emitter Controlled 4 diode, NTC, PressFIT Contact Technology and pre-applied Thermal Interface Material.

ParametricFS200R12PT4P
ConfigurationSixpack
IC(nom) / IF(nom)200.0A
VCE(sat) (Tvj=25°C typ)1.75V
VF (Tvj=25°C typ)1.7V
HousingEconoPACK™ 4
Sales Product NameFS200R12PT4P
OPNFS200R12PT4PBOSA1
Product Statusactive and preferred
Package NameAG-ECONO4-1
Completely lead freeno
Halogen freeno
RoHS compliantyes
Packing Size6
Packing TypeTRAY
Summary of Features:
  • Extended Operation Temperature T(vj op)
  • Low Switching Losses
  • Low V(CEsat)
  • V(CEsat) with positive Temperature Coefficient
  • 2.5 kV AC 1min Insulation
  • High Power Density
  • Isolated Base Plate
  • Standard Housing
Benefits:
  • Compact Modules
  • Easy and most reliable assembly
  • No Plugs and Cables required
  • Ideal for Low Inductive System Designs
Benefits:
  • Compact Modules
  • Easy and most reliable assembly
  • No Plugs and Cables required
  • Ideal for Low Inductive System Designs
功能框图
Data Sheet
TitleSizeDateVersion
FS200R12PT4P (chinese/english),CN/EN,EN/DE,JA/EN993 KB19 四月 201602_00
Product Brochure
TitleSizeDateVersion
Best-in-class products to meet your application demands；EN1.3 MB27 四月 201608_00
1EDI EiceDRIVER™ Compact 300 mil；EN216 KB09 五月 201601_00
Product Brochure Industrial Gate Driver ICs Overview；EN613 KB27 四月 201603_00
Application Notes
TitleSizeDateVersion
安装说明 EconoPACK™4 模块；CN；EN；DE1 MB20 八月 2012
等效热路模型；CN；EN；DE500 KB25 十一月 2013
Aging stability of various heatconducting pastes for use with modules without baseplates；EN111 KB10 二月 2014
Industrial IGBT Modules Explanation of Technical Information；EN；JA2.2 MB03 十二月 201501_02
Soldering of Econo and Easy Modules；EN194 KB10 二月 2014
如何正确计算并最大限度减小 IGBT 的死区时间；CN；EN1.5 MB26 八月 2013
Series connection of IGBTs；EN28 KB10 二月 2014
Application Note IGBT Definition of Junction Temperature；EN84 KB09 四月 2009
Modules with pre-applied Thermal interface Material；EN393 KB26 一月 201601_01
利用单极栅电压驱动IGBT；CN；EN384 KB03 十一月 201501_00
Paralleling of IGBTs；EN28 KB10 二月 2014
电力电子模块内部NTC的使用；CN；EN586 KB26 十一月 2013
Product Brief
TitleSizeDateVersion
EconoDUAL™, EconoPACK™ 4 and EconoPACK™ + Power Modules；EN440 KB27 四月 201607_00
PressFIT - Our established, reliable mounting technology；EN616 KB27 四月 201608_00
Thermal Interface Material (TIM) - The only Infineon-qualified solution；EN410 KB27 四月 201604_00
EconoPACK™4 Power Modules；EN106 KB27 四月 201607_00
Editorials
TitleSizeDateVersion
IGBT Module technology state of the art and future evolutions；EN37 KB07 二月 2014
1200V IGBT4 -High Power- a new Technology Generation with Optimized Characteristics for High Current Modules；EN141 KB07 二月 2014
On the loss - softness trade-off: Are different chip versions needed for softness-improvement?；EN731 KB31 一月 2011
The challenge of accurately analyzing thermal resistances；EN1.1 MB31 五月 2014
Comparison between active and passive thermal cycling stress with respect to substrate solder reliability in IGBT modules with Cu baseplates；EN704 KB31 五月 2014
Correlating NTC-Reading and Chip-Temperature in Power Electronic Modules；EN297 KB04 十一月 201501_00
Application Brochure
TitleSizeDateVersion
Solutions for Industrial Drives；EN2.4 MB27 四月 201609_00
Solutions for Uninterruptible Power Supply (UPS) Systems；EN2.6 MB27 四月 201608_00
Solutions for construction, commercial and agricultural vehicles (CAV)；EN6.7 MB30 七月 2014
Product Catalogue
TitleSizeDateVersion
Short Form Catalog - May 2016；EN4.4 MB09 五月 201601_00
Simulation Models
TitleSizeDateVersion
IPOSIM；EN3.4 MB18 三月 2014
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