FS3L30R07W2H3F_B11

EasyPACK 2B 650V 3-level NPC1 full-bridge IGBT module with NTC and PressFIT Contact Technology

ParametricFS3L30R07W2H3F_B11
Configuration3-level
IC(nom) / IF(nom)30.0A
VCE(sat) (Tvj=25°C typ)1.5V
VF (Tvj=25°C typ)1.6V
HousingEasyPACK 2B
Sales Product NameFS3L30R07W2H3F_B11
OPNFS3L30R07W2H3FB11BPSA1
Product Statusactive and preferred
Package NameAG-EASY2B-2
Completely lead freeno
Halogen freeno
RoHS compliantyes
Packing Size15
Packing TypeTRAY
Summary of Features:
  • High Speed IGBT H3
  • Low Switching Losses
  • CoolSiC™ Schottky Diode 650V
  • Al 2O 3 Substrate with Low Thermal Resistance
  • PressFIT Contact Technology
  • Rugged mounting due to integrated mounting clamps
Benefits:
  • Compact design
  • Optimized customer’s development cycle time and cost
Benefits:
  • Compact design
  • Optimized customer’s development cycle time and cost
功能框图
Data Sheet
TitleSizeDateVersion
FS3L30R07W2H3F_B11 (chinese/english),EN/CN,EN/DE,EN/JA1.2 MB22 七月 201403_01
Product Brochure
TitleSizeDateVersion
Product Brochure Industrial Gate Driver ICs Overview；EN613 KB27 四月 201603_00
Best-in-class products to meet your application demands；EN1.3 MB27 四月 201608_00
1EDI EiceDRIVER™ Compact 300 mil；EN216 KB09 五月 201601_00
Application Notes
TitleSizeDateVersion
Industrial IGBT Modules Explanation of Technical Information；EN；JA2.2 MB03 十二月 201501_02
利用单极栅电压驱动IGBT；CN；EN384 KB03 十一月 201501_00
电力电子模块内部NTC的使用；CN；EN586 KB26 十一月 2013
Application Note IGBT Definition of Junction Temperature；EN84 KB09 四月 2009
Assembly Instructions - Easy-PressFIT Modules；EN1.5 MB29 四月 201302_02
等效热路模型；CN；EN；DE500 KB25 十一月 2013
如何正确计算并最大限度减小 IGBT 的死区时间；CN；EN1.5 MB26 八月 2013
Application of screen print templates to paste thermal grease within IGBT modules；EN489 KB10 二月 2014
Aging stability of various heatconducting pastes for use with modules without baseplates；EN111 KB10 二月 2014
Series connection of IGBTs；EN28 KB10 二月 2014
Paralleling of IGBTs；EN28 KB10 二月 2014
Product Brief
TitleSizeDateVersion
Easy & Econo 模块；CN；EN588 KB25 十一月 2013
EasyB-系列模块 与Easy750；CN；EN524 KB25 十一月 2013
PressFIT - Our established, reliable mounting technology；EN616 KB27 四月 201608_00
Modules for Photo Voltaic String and Multi-String Inverters；EN476 KB27 四月 201604_00
3-Level Inverter Modules；EN307 KB27 四月 201608_00
Editorials
TitleSizeDateVersion
Correlating NTC-Reading and Chip-Temperature in Power Electronic Modules；EN297 KB04 十一月 201501_00
Using 650-V High Speed 3 IGBTs in Power Modules for Solar Inverter Performance Improvement；EN1.2 MB11 二月 2014
Reliability of PressFIT connections；EN472 KB06 六月 2008
Thermal Heat Sink Interface of IGBT Modules w/o Base Plate；EN384 KB07 二月 2014
PressFIT Technology, a Solderless Method for Mounting Power Modules；EN377 KB12 二月 2014
Impact of module parasitics on the performance of fast-switching devices；EN3.7 MB31 五月 2014
The challenge of accurately analyzing thermal resistances；EN1.1 MB31 五月 2014
Application Brochure
TitleSizeDateVersion
Solutions for Industrial Drives；EN2.4 MB27 四月 201609_00
Solutions for Uninterruptible Power Supply (UPS) Systems；EN2.6 MB27 四月 201608_00
Solutions for Solar Energy Systems；EN1.9 MB26 六月 201401_00
Product Catalogue
TitleSizeDateVersion
Short Form Catalog - May 2016；EN4.4 MB09 五月 201601_00
Material Content Data Sheet
TitleSizeDateVersion
MCDS - Easy2-B；EN78 KB06 二月 201503_01
Simulation Models
TitleSizeDateVersion
IPOSIM；EN3.4 MB18 三月 2014
EN/CN FS3L30R07W2H3F_B11
EN/DE FS3L30R07W2H3F_B11
EN/JA FS3L30R07W2H3F_B11
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