Parametric | IPG20N06S4L-14 |
---|
RDS (on)
(@10V)
max | 13.7mΩ |
---|
RDS (on)
max | 13.7mΩ |
---|
RDS (on)
(@4.5V)
max | 20.0mΩ |
---|
QG | 30.0nC |
---|
VDS
max | 60.0V |
---|
ID
max | 20.0A |
---|
RthJC
max | 3.0K/W |
---|
Ptot
max | 50.0W |
---|
IDpuls
max | 80.0A |
---|
VGS(th)
min
max | 1.2V
2.2V |
---|
Sales Product Name | IPG20N06S4L-14 |
---|
OPN | IPG20N06S4L14ATMA2 |
---|
Product Status | active and preferred |
---|
Package Name | PG-TDSON-8 |
---|
Completely lead free | no |
---|
Halogen free | yes |
---|
RoHS compliant | yes |
---|
Packing Size | 5000 |
---|
Packing Type | TAPE & REEL |
---|
Moisture Level | |
---|
| |
---|
OPN | IPG20N06S4L14ATMA1 |
---|
Product Status | discontinued |
---|
Package Name | PG-TDSON-8 |
---|
Completely lead free | no |
---|
Halogen free | yes |
---|
RoHS compliant | yes |
---|
Packing Size | 5000 |
---|
Packing Type | TAPE & REEL |
---|
Moisture Level | 1 |
---|
| Summary of Features:- Dual N-channel Logic Level - Enhancement mode
- AEC Q101 qualified
- MSL1 up to 260°C peak reflow
- 175°C operating temperature
- Green Product (RoHS compliant)
- 100% Avalanche tested
Benefits:- Dual Super S08 can replace multiple DPAKs for significant PCB area savings and system level cost reduction.
- Bond wire is 200um for up to 20A current
- Larger source lead frame connection for wire bonding
- Package: PG-TDSON-8-4
- Same thermal and electrical performance as a DPAK with the same die size.
- Exposed pad provides excellent thermal transfer (varies by die size)
- Two N-Channel MOSFETs in one package with 2 isolated leadframes
Target Applications:- Direct Fuel Injection
- ABS Valves
- Solenoid control
- Load Switches
- LED and Body lighting
|