S-COM10.6

CoM10.6 Dual Interface Module

Build with innovative  Coil on Module technology from Infineon to connect the module and the card antenna:

Moreover the reduced module thickness provides an unknown flexibility in the card construction.

Coil on Module demonstrates Infineon's technology leadership based on extensive semiconductor and module expertise as well as profound understanding of card manufacturer’s systems and requirements.

ParametricS-COM10.6
Product DescriptionDual Interface Module with inductive coupling for highly demanding applications
Pitch14.25mm
Dimensions13 x 11.8mm
Thicknessmax. 420µm
Contact SurfaceAu
ISO – ReferenceISO 7816-1, ISO 7810, ISO 10373-1/-3
DerivativesPd surface
Delivery FormsTape on Reel
ApplicationsHealthcare, Payment, Government Identification, Authentication
Product NameS-COM10.6
Description:
  • eliminates the galvanic connection process
  • simplifies the production
  • improves the production yield
  • improves the mechanical robustness
  • dedicated for 10 years life time applications
Application Brochure
TitleSizeDateVersion
Security for the connected world；EN1.5 MB18 二月 201602_16
Product Selection Guide
TitleSizeDateVersion
Infineon Chip Card & Security ICs Portfolio；EN2.1 MB03 十一月 201511_15
EN S-COM86
EN S-COM86
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