1PS70SB16: Dual Schottky barrier diode

Dual Planar Schottky barrier diode in common anode configuration with an integrated guard ring for stress protection, encapsulated in a very small SOT323 (SC-70) Surface-Mounted Device (SMD) plastic package.

SOT323
数据手册 (1)
名称/描述Modified Date
Dual Schottky barrier diode (REV 1.0) PDF (149.0 kB) 1PS70SB16 [English]17 Dec 2012
选型工具指南 (1)
名称/描述Modified Date
Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 [English]17 Feb 2016
封装信息 (1)
名称/描述Modified Date
plastic surface-mounted package; 3 leads (REV 1.0) PDF (217.0 kB) SOT323 [English]08 Feb 2016
包装 (1)
名称/描述Modified Date
Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (187.0 kB) SOT323_115 [English]16 Nov 2012
可靠性与质量信息 (2)
名称/描述Modified Date
1PS70SB16 NXP® Product Reliability (REV 1.1) PDF (83.0 kB) 1PS70SB16_1 [English]31 Jan 2015
1PS70SB16 NXP Product Quality (REV 1.3) PDF (74.0 kB) 1PS70SB16_NXP_PRODUCT_QUALITY [English]31 Jan 2015
支持信息 (1)
名称/描述Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
SPICE
订购信息
型号状态Package versionPackage name大小 (mm)IF (A)IR [max] (µA)ConfigurationVF [max] (mV)IFSM [max] (A)Cd [max] (pF)IR [max] (mA)VR [max] (V)IF [max] (mA)VR (V)
1PS70SB16ActiveSOT323SC-702 x 1.25 x 0.952@VR=25Vdual c.a.400@IF=10mA0.610@VR=1V30200
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期EFRIFR(FIT)MTBF(小时)MSLMSL LF
1PS70SB16SOT323Reflow_Soldering_ProfileReel 7" Q1/T1Active1PS70SB16,115 (9340 549 20115)7%6week 30, 2003157.00.731.37E911
Dual Schottky barrier diode 1PS70SB16
Discretes Semiconductors Selection Guide 2016 BUK7M12-60E
1PS70SB16 NXP® Product Reliability 1PS70SB16
1PS70SB16 NXP Product Quality 1PS70SB16
1ps70sb16 SPICE model 1PS70SB16
plastic surface-mounted package; 3 leads BSS84AKW
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Tape reel SMD; standard product orientation 12NC ending 115 BSS84AKW
PRF947