Dual Planar Schottky barrier diode in common anode configuration with an integrated guard ring for stress protection, encapsulated in a very small SOT323 (SC-70) Surface-Mounted Device (SMD) plastic package.
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Dual Schottky barrier diode (REV 1.0) PDF (149.0 kB) 1PS70SB16 [English] | 17 Dec 2012 |
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Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 [English] | 17 Feb 2016 |
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plastic surface-mounted package; 3 leads (REV 1.0) PDF (217.0 kB) SOT323 [English] | 08 Feb 2016 |
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Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (187.0 kB) SOT323_115 [English] | 16 Nov 2012 |
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1PS70SB16 NXP® Product Reliability (REV 1.1) PDF (83.0 kB) 1PS70SB16_1 [English] | 31 Jan 2015 |
1PS70SB16 NXP Product Quality (REV 1.3) PDF (74.0 kB) 1PS70SB16_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
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Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
型号 | 状态 | Package version | Package name | 大小 (mm) | IF (A) | IR [max] (µA) | Configuration | VF [max] (mV) | IFSM [max] (A) | Cd [max] (pF) | IR [max] (mA) | VR [max] (V) | IF [max] (mA) | VR (V) |
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1PS70SB16 | Active | SOT323 | SC-70 | 2 x 1.25 x 0.95 | 2@VR=25V | dual c.a. | 400@IF=10mA | 0.6 | 10@VR=1V | 30 | 200 |
产品编号 | 封装说明 | Outline Version | 回流/波峰焊接 | 包装 | 产品状态 | 部件编号订购码 (12NC) | Marking | 化学成分 | RoHS / 无铅 / RHF | 无铅转换日期 | EFR | IFR(FIT) | MTBF(小时) | MSL | MSL LF |
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1PS70SB16 | SOT323 | Reflow_Soldering_Profile | Reel 7" Q1/T1 | Active | 1PS70SB16,115 (9340 549 20115) | 7%6 | week 30, 2003 | 157.0 | 0.73 | 1.37E9 | 1 | 1 |