1PS74SB23: 肖特基势垒二极管
平面肖特基势垒二极管采用小型SC-74 (SOT457) SMD塑料封装。
1PS74SB23: 产品结构框图
SOT457
数据手册 (1)
| 名称/描述 | Modified Date |
|---|---|
| Schottky barrier diode (REV 3.0) PDF (54.0 kB) 1PS74SB23 [English] | 04 Aug 2003 |
选型工具指南 (1)
| 名称/描述 | Modified Date |
|---|---|
| Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 [English] | 17 Feb 2016 |
封装信息 (1)
| 名称/描述 | Modified Date |
|---|---|
| plastic surface-mounted package (TSOP6); 6 leads (REV 1.0) PDF (248.0 kB) SOT457 [English] | 08 Feb 2016 |
包装 (3)
| 名称/描述 | Modified Date |
|---|---|
| TSOP6; Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (187.0 kB) SOT457_115 [English] | 30 Nov 2012 |
| Tape reel SMD; reversed product orientation 12NC ending 125 (REV 1.0) PDF (187.0 kB) SOT457_125 [English] | 30 Nov 2012 |
| TSOP6; reel pack; reversed product orientation; 12NC ending 165 (REV 1.0) PDF (187.0 kB) SOT457_165 [English] | 30 Nov 2012 |
可靠性与质量信息 (2)
| 名称/描述 | Modified Date |
|---|---|
| 1PS74SB23 NXP® Product Reliability (REV 1.1) PDF (83.0 kB) 1PS74SB23_1 [English] | 31 Jan 2015 |
| 1PS74SB23 NXP Product Quality (REV 1.2) PDF (74.0 kB) 1PS74SB23_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
支持信息 (3)
| 名称/描述 | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
| Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English] | 30 Sep 2013 |
| MAR_SOT457 Topmark (REV 1.0) PDF (113.0 kB) MAR_SOT457 [English] | 03 Jun 2013 |
SPICE
- 1PS74SB23 SPICE model (REV 1.4) prm 1PS74SB23_1_2 7/22/2012
订购信息
| 型号 | 状态 | Package version | Package name | 大小 (mm) | IF (A) | IR [max] (µA) | Configuration | VF [max] (mV) | IFSM [max] (A) | Cd [max] (pF) | IR [max] (mA) | VR [max] (V) | IF [max] (mA) | VR (V) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 1PS74SB23 | Active | SOT457 | TSOP6 | 2.9 x 1.5 x 1 | 1 | single | 450@IF=1A | 25 | 100@VR=4V | 1@VR=25V | 25 |
封装环保信息
| 产品编号 | 封装说明 | Outline Version | 回流/波峰焊接 | 包装 | 产品状态 | 部件编号订购码 (12NC) | Marking | 化学成分 | RoHS / 无铅 / RHF | 无铅转换日期 | EFR | IFR(FIT) | MTBF（小时） | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 1PS74SB23 | | SOT457 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 7" Q1/T1 | Active | 1PS74SB23,115 (9340 549 21115) | P1 | 1PS74SB23 |    | Always Pb-free | 157.0 | 0.73 | 1.37E9 | 1 | 1 |
| Reel 13" Q3/T4 in LargePack, Reverse | Active | 1PS74SB23,165 (9340 549 21165) | P1 | 1PS74SB23 | | Always Pb-free | 157.0 | 0.73 | 1.37E9 | 1 | 1 | ||||
| Reel 7" Q3/T4, Reverse | Active | 1PS74SB23,125 (9340 549 21125) | P1 | 1PS74SB23 | | week 22, 2003 | 157.0 | 0.73 | 1.37E9 | 1 | 1 |
- Schottky barrier diode 1PS74SB23
- Discretes Semiconductors Selection Guide 2016 BUK7M12-60E
- 1PS74SB23 NXP® Product Reliability 1PS74SB23
- 1PS74SB23 NXP Product Quality 1PS74SB23
- MAR_SOT457 Topmark 74LVC2G17_Q100
- 1PS74SB23 SPICE model 1PS74SB23
- plastic surface-mounted package (TSOP6); 6 leads 74LVC2G17_Q100
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- TSOP6; Tape reel SMD; standard product orientation 12NC ending 115 pesd5v0s5ud
- TSOP6; reel pack; reversed product orientation; 12NC ending 165 bza456a
- Tape reel SMD; reversed product orientation 12NC ending 125 74LVC2G17_Q100
- 1PS74SB23
- SSL5021_SSL5031
