74AHC1G125GM: 总线缓冲器/线路驱动器；3态 _ BDTIC 中国领先电子元器件代理商

74AHC1G125GM: 总线缓冲器/线路驱动器；3态

74AHC1G125和74AHCT1G125是高速硅栅CMOS器件。它们提供一个带3态输出的非反相缓冲器/线路驱动器。3态输出通过输出使能输入(OE)控制。OE处的高电平使输出呈高阻抗关断状态。

AHC器件具有CMOS输入切换电平和2 V至5.5 V的电源电压范围。

AHCT器件具有TTL输入切换电平和4.5 V至5.5 V的电源电压范围。

Outline 3d SOT886

数据手册 (1)

名称/描述	Modified Date
Bus buffer/line driver; 3-state (REV 10.0) PDF (193.0 kB) 74AHC_AHCT1G125 [English]	23 Aug 2012

应用说明 (6)

名称/描述	Modified Date
Sorting through the low voltage logic maze (REV 1.0) PDF (72.0 kB) AN10156 [English]	13 Mar 2013
Package lead inductance considerations in high-speed applications (REV 1.0) PDF (43.0 kB) AN212 [English]	13 Mar 2013
Ground and VCC Bounce of High-Speed Integrated Circuits (REV 1.0) PDF (25.0 kB) AN223 [English]	13 Mar 2013
Live Insertion Aspects of Philips Logic Families (REV 1.0) PDF (73.0 kB) AN252 [English]	13 Mar 2013
Pin FMEA for AHC/AHCT family (REV 1.0) PDF (52.0 kB) AN11106 [English]	04 Nov 2011
MicroPak soldering information (REV 2.0) PDF (245.0 kB) AN10343 [English]	30 Dec 2010

手册 (2)

名称/描述	Modified Date
電圧レベルシフタ (REV 1.1) PDF (3.1 MB) 75017511_JP [English]	16 Feb 2015
Voltage translation: How to manage mixed-voltage designs with NXP® level translators (REV 1.0) PDF (2.6 MB) 75017511 [English]	20 May 2014

封装信息 (1)

名称/描述	Modified Date
XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm (REV 1.0) PDF (189.0 kB) SOT886 [English]	08 Feb 2016

包装 (2)

名称/描述	Modified Date
XSON6; Reel pack; SMD, 7" Q1/T1 Standard product orientation Orderable part number ending ,115 or X Ordering... (REV 2.0) PDF (205.0 kB) SOT886_115 [English]	23 Apr 2013
XSON6; reel pack; standard product orientation; 12NC ending 132 (REV 1.0) PDF (180.0 kB) SOT886_132 [English]	28 Nov 2012

支持信息 (2)

名称/描述	Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]	30 Sep 2013
MAR_SOT886 Topmark (REV 1.0) PDF (73.0 kB) MAR_SOT886 [English]	03 Jun 2013

IBIS

ahc1g125 IBIS model (REV 1.0) ibs AHC1G125 4/7/2013

订购信息

型号	状态	Family	功能	V_CC (V)	说明	Logic switching levels	Output drive capability (mA)	Package version	f_max (MHz)	No of bits	Power dissipation considerations	t_pd (ns)	T_amb (Cel)	R_th(j-a) (K/W)	Ψ_th(j-top) (K/W)	R_th(j-c) (K/W)	Package name	No of pins
74AHC1G125GM	Active	AHC(T)	Buffers/inverters/drivers	2.0 - 5.5	single buffer/line driver (3-state)	CMOS	+/- 8	SOT886	60	1	low	3.4	-40~125	318	8.1	161	XSON6	6

封装环保信息

产品编号	封装说明	Outline Version	回流/波峰焊接	包装	产品状态	部件编号订购码 (12NC)	Marking	化学成分	RoHS / 无铅 / RHF	无铅转换日期	EFR	IFR(FIT)	MTBF（小时）	MSL	MSL LF
74AHC1G125GM		SOT886	Reflow_Soldering_Profile	Reel 7" Q1/T1, Q3/T4	Active	74AHC1G125GM,132 (9352 855 23132)	AM	74AHC1G125GM		Always Pb-free	84.9	6.62	1.51E8	1	1
74AHC1G125GM		SOT886	Reflow_Soldering_Profile	Reel 7" Q1/T1	Active	74AHC1G125GM,115 (9352 855 23115)	AM	74AHC1G125GM		Always Pb-free	84.9	6.62	1.51E8	1	1

Bus buffer/line driver; 3-state 74AHCT1G125GW

Sorting through the low voltage logic maze 74LVC_H_245A_Q100

Package lead inductance considerations in high-speed applications 74LVC_H_245A_Q100

Ground and VCC Bounce of High-Speed Integrated Circuits 74ALVC164245DGG-Q100

Live Insertion Aspects of Philips Logic Families 74HC_T_245_Q100

Pin FMEA for AHC/AHCT family 74AHC_T_245_Q100

MicroPak soldering information NTS0102_Q100

電圧レベルシフタ 74AVC16245DGG-Q100

Voltage translation: How to manage mixed-voltage designs with NXP® level translators 74AVC16245DGG-Q100

MAR_SOT886 Topmark prtr5v0u2f

ahc1g125 IBIS model 74AHC1G125GW

XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm prtr5v0u2f

Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20

XSON6; reel pack; standard product orientation; 12NC ending 132 NCX2200GM

XSON6; Reel pack; SMD, 7" Q1/T1 Standard product orientation Orderable part number ending ,115 or X Ordering... prtr5v0u2f

BGU8007

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