74AHC30D: 8输入与非门
74AHC30；74AHCT30是高速硅栅CMOS器件，与低功耗肖特基TTL (LSTTL)针脚兼容。该类器件的规格符合JEDEC标准No. 7-A。
74AHC30；74AHCT30提供一个8输入与非功能。
74AHC30D: 产品结构框图
sot108-1_3d
数据手册 (1)
| 名称/描述 | Modified Date |
|---|---|
| 8-input NAND gate (REV 4.0) PDF (186.0 kB) 74AHC_AHCT30 [English] | 22 Jul 2015 |
应用说明 (5)
| 名称/描述 | Modified Date |
|---|---|
| Sorting through the low voltage logic maze (REV 1.0) PDF (72.0 kB) AN10156 [English] | 13 Mar 2013 |
| Package lead inductance considerations in high-speed applications (REV 1.0) PDF (43.0 kB) AN212 [English] | 13 Mar 2013 |
| Ground and VCC Bounce of High-Speed Integrated Circuits (REV 1.0) PDF (25.0 kB) AN223 [English] | 13 Mar 2013 |
| Live Insertion Aspects of Philips Logic Families (REV 1.0) PDF (73.0 kB) AN252 [English] | 13 Mar 2013 |
| Pin FMEA for AHC/AHCT family (REV 1.0) PDF (52.0 kB) AN11106 [English] | 04 Nov 2011 |
封装信息 (1)
| 名称/描述 | Modified Date |
|---|---|
| plastic small outline package; 14 leads; body width 3.9 mm (REV 1.0) PDF (166.0 kB) SOT108-1 [English] | 08 Feb 2016 |
包装 (1)
| 名称/描述 | Modified Date |
|---|---|
| SO14; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or J Ordering... (REV 4.0) PDF (207.0 kB) SOT108-1_118 [English] | 08 Apr 2013 |
支持信息 (2)
| 名称/描述 | Modified Date |
|---|---|
| Footprint for reflow soldering (REV 1.0) PDF (9.0 kB) SO-SOJ-REFLOW [English] | 08 Oct 2009 |
| Footprint for wave soldering (REV 1.0) PDF (8.0 kB) SO-SOJ-WAVE [English] | 08 Oct 2009 |
IBIS
- 74AHC30 IBIS model (REV 1.0) ibs AHC30 8/31/2015
订购信息
| 型号 | 状态 | Family | VCC (V) | 功能 | 类型 | Logic switching levels | 说明 | Package version | Output drive capability (mA) | tpd (ns) | fmax (MHz) | No of bits | Power dissipation considerations | Tamb (Cel) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name | No of pins |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 74AHC30D | Active | AHC(T) | 2.0 - 5.5 | NAND gates | NAND gates | CMOS | 8-input NAND gate | SOT108-1 | +/- 8 | 3.6 | 60 | 1 | low | -40~125 | 111 | 21.9 | 69 | SO14 | 14 |
封装环保信息
| 产品编号 | 封装说明 | Outline Version | 回流/波峰焊接 | 包装 | 产品状态 | 部件编号订购码 (12NC) | Marking | 化学成分 | RoHS / 无铅 / RHF | 无铅转换日期 | EFR | IFR(FIT) | MTBF（小时） | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 74AHC30D | | SOT108-1 | SO-SOJ-REFLOW
SO-SOJ-WAVE SO-SOJ-REFLOW SO-SOJ-WAVE | Reel 13" Q1/T1 | Active | 74AHC30D,118 (9352 641 86118) | 74AHC30D | 74AHC30D |    | week 32, 2004 | 84.9 | 6.62 | 1.51E8 | 1 | 1 |
| Bulk Pack | Active | 74AHC30D,112 (9352 641 86112) | 74AHC30D | 74AHC30D | | week 32, 2004 | 84.9 | 6.62 | 1.51E8 | 1 | 1 |
- 8-input NAND gate 74AHC30PW
- Sorting through the low voltage logic maze 74LVC_H_245A_Q100
- Package lead inductance considerations in high-speed applications 74LVC_H_245A_Q100
- Ground and VCC Bounce of High-Speed Integrated Circuits 74ALVC164245DGG-Q100
- Live Insertion Aspects of Philips Logic Families 74HC_T_245_Q100
- Pin FMEA for AHC/AHCT family 74AHC_T_245_Q100
- 74AHC30 IBIS model 74AHC30PW
- plastic small outline package; 14 leads; body width 3.9 mm 74LV164_Q100
- Footprint for reflow soldering NPIC6C596A_Q100
- Footprint for wave soldering NPIC6C596A_Q100
- SO14; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or J Ordering... 74LV164_Q100
- 74AHC_T_30
- UBA2213
