74AHCU04: 六位元进制反相器

74AHCU04是高速硅栅CMOS器件,与低功耗肖特基TTL (LSTTL)针脚兼容。该器件的规格符合JEDEC标准No. 7A。

74AHCU04是一个通用六位元反相器。六个反相器中的每一个都是一个单级。

74AHCU04: 产品结构框图
Outline 3d SOT402-1
数据手册 (1)
名称/描述Modified Date
Hex unbuffered inverter (REV 4.0) PDF (139.0 kB) 74AHCU04 [English]07 Dec 2015
应用说明 (4)
名称/描述Modified Date
Sorting through the low voltage logic maze (REV 1.0) PDF (72.0 kB) AN10156 [English]13 Mar 2013
Package lead inductance considerations in high-speed applications (REV 1.0) PDF (43.0 kB) AN212 [English]13 Mar 2013
Ground and VCC Bounce of High-Speed Integrated Circuits (REV 1.0) PDF (25.0 kB) AN223 [English]13 Mar 2013
Live Insertion Aspects of Philips Logic Families (REV 1.0) PDF (73.0 kB) AN252 [English]13 Mar 2013
封装信息 (3)
名称/描述Modified Date
plastic small outline package; 14 leads; body width 3.9 mm (REV 1.0) PDF (166.0 kB) SOT108-1 [English]08 Feb 2016
plastic thin shrink small outline package; 14 leads; body width 4.4 mm (REV 1.0) PDF (285.0 kB) SOT402-1 [English]08 Feb 2016
plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 14 terminals; body 2.5 x 3 x... (REV 1.0) PDF (187.0 kB) SOT762-1 [English]08 Feb 2016
包装 (3)
名称/描述Modified Date
Standard product orientation 12NC ending 115 (REV 3.0) PDF (108.0 kB) SOT762-1_115 [English]09 Apr 2013
SO14; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or J Ordering... (REV 4.0) PDF (207.0 kB) SOT108-1_118 [English]08 Apr 2013
TSSOP14; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or... (REV 1.0) PDF (217.0 kB) SOT402-1_118 [English]08 Apr 2013
支持信息 (3)
名称/描述Modified Date
Footprint for reflow soldering (REV 1.0) PDF (9.0 kB) SO-SOJ-REFLOW [English]08 Oct 2009
Footprint for wave soldering (REV 1.0) PDF (8.0 kB) SO-SOJ-WAVE [English]08 Oct 2009
Footprint for wave soldering (REV 1.0) PDF (16.0 kB) SSOP-TSSOP-VSO-WAVE [English]08 Oct 2009
IBIS
订购信息
型号状态
74AHCU04DActive
74AHCU04BQActive
74AHCU04PWActive
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期EFRIFR(FIT)MTBF(小时)MSLMSL LF
74AHCU04BQSOT762-1Reel 7" Q1/T1Active74AHCU04BQ,115 (9352 855 51115)AHU0474AHCU04BQAlways Pb-free84.96.621.51E811
74AHCU04DSOT108-1SO-SOJ-REFLOW SO-SOJ-WAVE
SO-SOJ-REFLOW SO-SOJ-WAVE
Reel 13" Q1/T1Active74AHCU04D,118 (9352 630 42118)74AHCU04D74AHCU04Dweek 32, 200484.96.621.51E811
Bulk PackActive74AHCU04D,112 (9352 630 42112)74AHCU04D74AHCU04Dweek 32, 200484.96.621.51E811
74AHCU04PWSOT402-1SSOP-TSSOP-VSO-WAVEReel 13" Q1/T1Active74AHCU04PW,118 (9352 630 43118)AHCU0474AHCU04PWweek 10, 200584.96.621.51E811
Bulk PackActive74AHCU04PW,112 (9352 630 43112)AHCU0474AHCU04PWweek 10, 200584.96.621.51E811
Hex unbuffered inverter 74AHCU04PW
Sorting through the low voltage logic maze 74LVC_H_245A_Q100
Package lead inductance considerations in high-speed applications 74LVC_H_245A_Q100
Ground and VCC Bounce of High-Speed Integrated Circuits 74ALVC164245DGG-Q100
Live Insertion Aspects of Philips Logic Families 74HC_T_245_Q100
ahcu04 IBIS model 74AHCU04PW
plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 14 terminals; body 2.5 x 3 x... 74LV164_Q100
Standard product orientation 12NC ending 115 74LV164_Q100
plastic small outline package; 14 leads; body width 3.9 mm 74LV164_Q100
Footprint for reflow soldering NPIC6C596A_Q100
Footprint for wave soldering NPIC6C596A_Q100
SO14; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or J Ordering... 74LV164_Q100
plastic thin shrink small outline package; 14 leads; body width 4.4 mm 74LV164_Q100
SSOP-TSSOP-VSO-WAVE LPC1114FDH28
TSSOP14; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or... 74LV164_Q100
74LVC04A
74LV164
UBA2213
74LV164