74AUP1G3208: 低功耗3输入或与门 _ BDTIC 中国领先电子元器件代理商

74AUP1G3208: 低功耗3输入或与门

74AUP1G3208提供布尔函数：Y = (A + B) x C。用户可以选择逻辑功能OR、AND和OR-AND。所有输入都可连接到VCC或GND。

所有输入处的施密特触发器动作使电路容许整个0.8 V至3.6 V VCC范围内较慢的输入上升和下降时间。

该器件可确保整个0.8 V至3.6 V VCC范围内的极低静态和动态功耗。

该器件完全适合使用IOFF的局部掉电应用。IOFF电路可禁用输出，防止掉电时破坏性回流电流通过该器件。

74AUP1G3208: 产品结构框图

SOT363

数据手册 (1)

名称/描述	Modified Date
Low-power 3-input OR-AND gate (REV 6.0) PDF (189.0 kB) 74AUP1G3208 [English]	09 Mar 2016

应用说明 (4)

名称/描述	Modified Date
Sorting through the low voltage logic maze (REV 1.0) PDF (72.0 kB) AN10156 [English]	13 Mar 2013
Pin FMEA for AUP family (REV 1.0) PDF (53.0 kB) AN11052 [English]	06 May 2011
MicroPak soldering information (REV 2.0) PDF (245.0 kB) AN10343 [English]	30 Dec 2010
PicoGate Logic footprints (REV 1.0) PDF (87.0 kB) AN10161 [English]	30 Oct 2002

手册 (3)

名称/描述	Modified Date
電圧レベルシフタ (REV 1.1) PDF (3.1 MB) 75017511_JP [English]	16 Feb 2015
NXP® ultra-low-power CMOS logic 74AUP1G/2G/3Gxxx: Advanced, ultra-low-power CMOS logic (REV 1.0) PDF (1.4 MB) 75017458 [English]	13 Oct 2014
Voltage translation: How to manage mixed-voltage designs with NXP® level translators (REV 1.0) PDF (2.6 MB) 75017511 [English]	20 May 2014

选型工具指南 (2)

名称/描述	Modified Date
ロジック製品セレクションガイド... (REV 1.0) PDF (38.3 MB) LOGIC_SELECTION_GUIDE_2015_JP [English]	19 Nov 2015
Logic selection guide 2016 (REV 1.1) PDF (15.3 MB) 75017285 [English]	08 Jan 2015

封装信息 (6)

名称/描述	Modified Date
plastic thermal enhanced extremely thin small outline package; no leads;6 terminals; body 1.0 x 0.8 x 0.35 mm (REV 1.1) PDF (217.0 kB) SOT1255 [English]	22 Apr 2016
extremely thin small outline package; no leads; 6 terminals (REV 1.0) PDF (176.0 kB) SOT1115 [English]	08 Feb 2016
XSON6: extremely thin small outline package; no leads; 6 terminals; body 1.0 x 1.0 x 0.35 mm (REV 1.0) PDF (192.0 kB) SOT1202 [English]	08 Feb 2016
plastic surface-mounted package; 6 leads (REV 1.0) PDF (246.0 kB) SOT363_1 [English]	08 Feb 2016
XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm (REV 1.0) PDF (189.0 kB) SOT886 [English]	08 Feb 2016
XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1 x 0.5 mm (REV 1.0) PDF (185.0 kB) SOT891 [English]	08 Feb 2016

包装 (7)

名称/描述	Modified Date
X2SON6; Reel pack, SMD, 7" Q2/T3 standard product orientation Orderable part number ending ,147 or... (REV 3.0) PDF (202.0 kB) SOT1255_147 [English]	20 Oct 2016
XSON6; reel pack; standard product orientation; 12NC ending 132 (REV 1.0) PDF (180.0 kB) SOT891_132 [English]	26 Aug 2014
XSON6; Reel pack; SMD, 7" Q1/T1 Standard product orientation Orderable part number ending ,115 or X Ordering... (REV 2.0) PDF (205.0 kB) SOT886_115 [English]	23 Apr 2013
Reversed product orientation 12NC ending 132 (REV 2.0) PDF (92.0 kB) SOT1115_132 [English]	04 Apr 2013
Reversed product orientation 12NC ending 132 (REV 2.0) PDF (92.0 kB) SOT1202_132 [English]	04 Apr 2013
XSON6; reel pack; standard product orientation; 12NC ending 132 (REV 1.0) PDF (180.0 kB) SOT886_132 [English]	28 Nov 2012
Tape reel SMD; reversed product orientation 12NC ending 125 (REV 1.0) PDF (188.0 kB) SOT363_125 [English]	20 Nov 2012

支持信息 (7)

名称/描述	Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]	30 Sep 2013
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English]	30 Sep 2013
MAR_SOT1115 Topmark (REV 1.0) PDF (47.0 kB) MAR_SOT1115 [English]	03 Jun 2013
MAR_SOT1202 Topmark (REV 1.0) PDF (49.0 kB) MAR_SOT1202 [English]	03 Jun 2013
MAR_SOT363 Topmark (REV 1.0) PDF (104.0 kB) MAR_SOT363 [English]	03 Jun 2013
MAR_SOT886 Topmark (REV 1.0) PDF (73.0 kB) MAR_SOT886 [English]	03 Jun 2013
MAR_SOT891 Topmark (REV 1.0) PDF (51.0 kB) MAR_SOT891 [English]	03 Jun 2013

IBIS

74AUP1G3208 IBIS model (REV 1.0) ibs AUP1G3208 2/25/2016

订购信息

型号	状态	Family	类型	说明	V_CC (V)	Logic switching levels	Output drive capability (mA)	t_pd (ns)	f_max (MHz)	No of bits	Power dissipation considerations	T_amb (Cel)	R_th(j-a) (K/W)	Ψ_th(j-top) (K/W)	R_th(j-c) (K/W)	No of pins	Package name	Package version
74AUP1G3208GW	Active	AUP	Combination gates	single 3-input OR-AND gate	1.1 - 3.6	CMOS	+/- 1.9	7.4	70	1	ultra low	-40~125	264	38.6	153	6	TSSOP6	SOT363
74AUP1G3208GM	Active	AUP	Combination gates	single 3-input OR-AND gate	1.1 - 3.6	CMOS	+/- 1.9	7.4	70	1	ultra low	-40~125	290	6.5	145	6	XSON6	SOT886
74AUP1G3208GX	Active															6	X2SON6	SOT1255
74AUP1G3208GS	Active	AUP	Combination gates	single 3-input OR-AND gate	1.1 - 3.6	CMOS	+/- 1.9	7.4	70	1	ultra low	-40~125	272	14.8	177	6	XSON6	SOT1202
74AUP1G3208GN	Active	AUP	Combination gates	single 3-input OR-AND gate	1.1 - 3.6	CMOS	+/- 1.9	7.4	70	1	ultra low	-40~125	275	11.7	171	6	XSON6	SOT1115
74AUP1G3208GF	Active	AUP	Combination gates	single 3-input OR-AND gate	1.1 - 3.6	CMOS	+/- 1.9	7.4	70	1	ultra low	-40~125	290	6.5	145	6	XSON6	SOT891

封装环保信息

产品编号	封装说明	Outline Version	回流/波峰焊接	包装	产品状态	部件编号订购码 (12NC)	Marking	化学成分	RoHS / 无铅 / RHF	无铅转换日期	EFR	IFR(FIT)	MTBF（小时）	MSL	MSL LF
74AUP1G3208GS		SOT1202		Reel 7" Q1/T1, Q3/T4	Active	74AUP1G3208GS,132 (9352 928 58132)	a2	74AUP1G3208GS		Always Pb-free				1	1
74AUP1G3208GF		SOT891	Reflow_Soldering_Profile	Reel 7" Q1/T1, Q3/T4	Active	74AUP1G3208GF,132 (9352 813 23132)	a2	74AUP1G3208GF		Always Pb-free	0.0	3.29	3.04E8	1	1
74AUP1G3208GW		SOT363	Reflow_Soldering_Profile Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile	Reel 7" Q3/T4, Reverse	Active	74AUP1G3208GW,125 (9352 806 16125)	a2	74AUP1G3208GW		Always Pb-free	0.0	3.29	3.04E8	1	1
74AUP1G3208GN		SOT1115		Reel 7" Q1/T1, Q3/T4	Active	74AUP1G3208GN,132 (9352 917 34132)	a2	74AUP1G3208GN		Always Pb-free				1	1
74AUP1G3208GM		SOT886	Reflow_Soldering_Profile	Reel 7" Q1/T1, Q3/T4	Active	74AUP1G3208GM,132 (9352 806 17132)	a2	74AUP1G3208GM		Always Pb-free	0.0	3.29	3.04E8	1	1
74AUP1G3208GM		SOT886	Reflow_Soldering_Profile	Reel 7" Q1/T1	Active	74AUP1G3208GM,115 (9352 806 17115)	a2	74AUP1G3208GM		Always Pb-free	0.0	3.29	3.04E8	1	1
74AUP1G3208GX		SOT1255		Reel 7" Q2/T3	Active	74AUP1G3208GXZ (9353 084 66147)	Standard Marking	74AUP1G3208GX		Always Pb-free				1	1

Low-power 3-input OR-AND gate 74AUP1G3208GW

Sorting through the low voltage logic maze 74LVC_H_245A_Q100

Pin FMEA for AUP family 74AUP1T34GW-Q100

MicroPak soldering information NTS0102_Q100

PicoGate Logic footprints NX3L4684

電圧レベルシフタ 74AVC16245DGG-Q100

NXP® ultra-low-power CMOS logic 74AUP1G/2G/3Gxxx: Advanced, ultra-low-power CMOS logic 74AUP1G86GW-Q100

Voltage translation: How to manage mixed-voltage designs with NXP® level translators 74AVC16245DGG-Q100

ロジック製品セレクションガイド... 74LVC_H_245A_Q100

Logic selection guide 2016 74LVC_H_245A_Q100

MAR_SOT1115 Topmark 74AUP1G332

MAR_SOT1202 Topmark NCX2200GS

MAR_SOT363 Topmark BSS84AKS

MAR_SOT886 Topmark prtr5v0u2f

MAR_SOT891 Topmark prtr5v0u2k

74AUP1G3208 IBIS model 74AUP1G3208GW

XSON6: extremely thin small outline package; no leads; 6 terminals; body 1.0 x 1.0 x 0.35 mm NCX2200GS

Reversed product orientation 12NC ending 132 NTS0101

XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1 x 0.5 mm prtr5v0u2k

XSON6; reel pack; standard product orientation; 12NC ending 132 prtr5v0u2k

plastic surface-mounted package; 6 leads BSS84AKS

Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20

Tape reel SMD; reversed product orientation 12NC ending 125 74LVC2G17_Q100

SOT1115 74AUP1G332

Reel 7" Q1/T1, Q3/T4 74AUP1G332

XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm prtr5v0u2f

Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20

XSON6; reel pack; standard product orientation; 12NC ending 132 NCX2200GM

XSON6; Reel pack; SMD, 7" Q1/T1 Standard product orientation Orderable part number ending ,115 or X Ordering... prtr5v0u2f

SOT1255 74AUP1G3208

Reel 7" Q2/T3 74AUP1G3208

74AUP1G3208

74LVC2G17

BGU7003

BFU520Y

74LVC2G17

BGU8007

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