74AUP2G3407: 低功耗单路缓冲器；单路缓冲器，带开漏 _ BDTIC 中国领先电子元器件代理商

74AUP2G3407: 低功耗单路缓冲器；单路缓冲器，带开漏

74AUP2G3407是带开漏输出的单路缓冲器。该器件具有两个输入针脚(nA)、一个输出针脚(1Y)和一个开漏输出针脚(2Y)。

所有输入处的施密特触发器动作使电路容许整个0.8 V至3.6 V的VCC范围内较慢的输入上升和下降时间。

该器件可确保整个0.8 V至3.6 V VCC范围内的极低静态和动态功耗。

该器件完全适合使用IOFF的局部掉电应用。IOFF电路可禁用输出，防止掉电时破坏性回流电流通过该器件。

SOT363

数据手册 (1)

名称/描述	Modified Date
Low-power single buffer; single buffer with open-drain (REV 1.0) PDF (221.0 kB) 74AUP2G3407 [English]	18 Oct 2013

手册 (3)

名称/描述	Modified Date
電圧レベルシフタ (REV 1.1) PDF (3.1 MB) 75017511_JP [English]	16 Feb 2015
NXP® ultra-low-power CMOS logic 74AUP1G/2G/3Gxxx: Advanced, ultra-low-power CMOS logic (REV 1.0) PDF (1.4 MB) 75017458 [English]	13 Oct 2014
Voltage translation: How to manage mixed-voltage designs with NXP® level translators (REV 1.0) PDF (2.6 MB) 75017511 [English]	20 May 2014

选型工具指南 (2)

名称/描述	Modified Date
ロジック製品セレクションガイド... (REV 1.0) PDF (38.3 MB) LOGIC_SELECTION_GUIDE_2015_JP [English]	19 Nov 2015
Logic selection guide 2016 (REV 1.1) PDF (15.3 MB) 75017285 [English]	08 Jan 2015

封装信息 (5)

名称/描述	Modified Date
extremely thin small outline package; no leads; 6 terminals (REV 1.0) PDF (176.0 kB) SOT1115 [English]	08 Feb 2016
XSON6: extremely thin small outline package; no leads; 6 terminals; body 1.0 x 1.0 x 0.35 mm (REV 1.0) PDF (192.0 kB) SOT1202 [English]	08 Feb 2016
plastic surface-mounted package; 6 leads (REV 1.0) PDF (246.0 kB) SOT363_1 [English]	08 Feb 2016
XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm (REV 1.0) PDF (189.0 kB) SOT886 [English]	08 Feb 2016
XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1 x 0.5 mm (REV 1.0) PDF (185.0 kB) SOT891 [English]	08 Feb 2016

包装 (1)

名称/描述	Modified Date
Tape reel SMD; reversed product orientation 12NC ending 125 (REV 1.0) PDF (188.0 kB) SOT363_125 [English]	20 Nov 2012

支持信息 (7)

名称/描述	Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]	30 Sep 2013
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English]	30 Sep 2013
MAR_SOT1115 Topmark (REV 1.0) PDF (47.0 kB) MAR_SOT1115 [English]	03 Jun 2013
MAR_SOT1202 Topmark (REV 1.0) PDF (49.0 kB) MAR_SOT1202 [English]	03 Jun 2013
MAR_SOT363 Topmark (REV 1.0) PDF (104.0 kB) MAR_SOT363 [English]	03 Jun 2013
MAR_SOT886 Topmark (REV 1.0) PDF (73.0 kB) MAR_SOT886 [English]	03 Jun 2013
MAR_SOT891 Topmark (REV 1.0) PDF (51.0 kB) MAR_SOT891 [English]	03 Jun 2013

IBIS

aup2g3407 IBIS model (REV 1.0) ibs AUP2G3407 12/22/2014

订购信息

型号	状态	Family	类型	说明	V_CC (V)	Logic switching levels	Output drive capability (mA)	t_pd (ns)	f_max (MHz)	No of bits	Power dissipation considerations	T_amb (Cel)	R_th(j-a) (K/W)	Ψ_th(j-top) (K/W)	R_th(j-c) (K/W)	No of pins	Package name	Package version
74AUP2G3407GF	Active	AUP	Combination gates	buffer and buffer with open-drain	1.1 - 3.6	CMOS	+/- 1.9	4.1	70	2	ultra low	-40~125	290	6.5	145	6	XSON6	SOT891
74AUP2G3407GS	Active	AUP	Combination gates	buffer and buffer with open-drain	1.1 - 3.6	CMOS	+/- 1.9	4.1	70	2	ultra low	-40~125	272	14.8	177	6	XSON6	SOT1202
74AUP2G3407GM	Active	AUP	Combination gates	buffer and buffer with open-drain	1.1 - 3.6	CMOS	+/- 1.9	4.1	70	2	ultra low	-40~125	290	6.5	145	6	XSON6	SOT886
74AUP2G3407GN	Active	AUP	Combination gates	buffer and buffer with open-drain	1.1 - 3.6	CMOS	+/- 1.9	4.1	70	2	ultra low	-40~125	275	11.7	171	6	XSON6	SOT1115
74AUP2G3407GW	Active	AUP	Combination gates	buffer and buffer with open-drain	1.1 - 3.6	CMOS	+/- 1.9	4.1	70	2	ultra low	-40~125	264	38.6	153	6	TSSOP6	SOT363

封装环保信息

产品编号	封装说明	Outline Version	回流/波峰焊接	包装	产品状态	部件编号订购码 (12NC)	Marking	化学成分	RoHS / 无铅 / RHF	无铅转换日期	MSL	MSL LF
74AUP2G3407GM		SOT886	Reflow_Soldering_Profile	Reel 7" Q3/T4, Reverse	Active	74AUP2G3407GMH (9353 024 21125)	Standard Marking	74AUP2G3407GM		Always Pb-free	1	1
74AUP2G3407GS		SOT1202		Reel 7" Q3/T4, Reverse	Active	74AUP2G3407GSH (9353 024 24125)	Standard Marking	74AUP2G3407GS		Always Pb-free	1	1
74AUP2G3407GW		SOT363	Reflow_Soldering_Profile Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile	Reel 7" Q3/T4, Reverse	Active	74AUP2G3407GWH (9353 024 19125)	Standard Marking	74AUP2G3407GW		Always Pb-free	1	1
74AUP2G3407GF		SOT891	Reflow_Soldering_Profile	Reel 7" Q3/T4, Reverse	Active	74AUP2G3407GFH (9353 024 22125)	Standard Marking	74AUP2G3407GF		Always Pb-free	1	1
74AUP2G3407GN		SOT1115		Reel 7" Q3/T4, Reverse	Active	74AUP2G3407GNH (9353 024 23125)	Standard Marking	74AUP2G3407GN		Always Pb-free	1	1

Low-power single buffer; single buffer with open-drain 74AUP2G3407GW

電圧レベルシフタ 74AVC16245DGG-Q100

NXP® ultra-low-power CMOS logic 74AUP1G/2G/3Gxxx: Advanced, ultra-low-power CMOS logic 74AUP1G86GW-Q100

Voltage translation: How to manage mixed-voltage designs with NXP® level translators 74AVC16245DGG-Q100

ロジック製品セレクションガイド... 74LVC_H_245A_Q100

Logic selection guide 2016 74LVC_H_245A_Q100

MAR_SOT1115 Topmark 74AUP1G332

MAR_SOT1202 Topmark NCX2200GS

MAR_SOT363 Topmark BSS84AKS

MAR_SOT886 Topmark prtr5v0u2f

MAR_SOT891 Topmark prtr5v0u2k

aup2g3407 IBIS model 74AUP2G3407GW

XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm prtr5v0u2f

XSON6: extremely thin small outline package; no leads; 6 terminals; body 1.0 x 1.0 x 0.35 mm NCX2200GS

plastic surface-mounted package; 6 leads BSS84AKS

Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20

Tape reel SMD; reversed product orientation 12NC ending 125 74LVC2G17_Q100

XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1 x 0.5 mm prtr5v0u2k

Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20

SOT1115 74AUP1G332

BGU8007

74LVC2G17

BFU520Y

BGU7003

74LVC2G17

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