74AXP2G17GM: Low-power dual Schmitt trigger
The 74AXP2G17 is a dual Schmitt trigger buffer. It can transform slowly changing input signals into sharply defined, jitter-free output signals.
This device ensures very low static and dynamic power consumption across the entire VCC range from 0.7 V to 2.75 V. It is fully specified for partial power down applications using IOFF. The IOFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down.
Outline 3d SOT886
数据手册 (1)
| 名称/描述 | Modified Date |
|---|---|
| Low-power dual Schmitt trigger (REV 1.0) PDF (185.0 kB) 74AXP2G17 [English] | 12 Nov 2015 |
封装信息 (1)
| 名称/描述 | Modified Date |
|---|---|
| XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm (REV 1.0) PDF (189.0 kB) SOT886 [English] | 08 Feb 2016 |
支持信息 (2)
| 名称/描述 | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
| MAR_SOT886 Topmark (REV 1.0) PDF (73.0 kB) MAR_SOT886 [English] | 03 Jun 2013 |
IBIS
- 74AXP2G17 IBIS model (REV 1.0) ibs AXP2G17 10/20/2015
订购信息
| 型号 | 状态 | 功能 | VCC (V) | Family | 说明 | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | No of bits | Power dissipation considerations | Tamb (Cel) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name | No of pins | Package version |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 74AXP2G17GM | Active | XSON6 | 6 | SOT886 |
封装环保信息
| 产品编号 | 封装说明 | Outline Version | 回流/波峰焊接 | 包装 | 产品状态 | 部件编号订购码 (12NC) | Marking | 化学成分 | RoHS / 无铅 / RHF | 无铅转换日期 | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 74AXP2G17GM | | SOT886 | Reflow_Soldering_Profile | Reel 7" Q3/T4, Reverse | Active | 74AXP2G17GMH (9353 066 36125) | Standard Marking | 74AXP2G17GM |    | Always Pb-free | 1 | 1 |
- Low-power dual Schmitt trigger 74AXP2G17GS
- MAR_SOT886 Topmark prtr5v0u2f
- 74AXP2G17 IBIS model 74AXP2G17GS
- XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm prtr5v0u2f
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- BGU8007
