74LVC1G66是低功耗、低电压硅栅CMOS器件。
74LVC1G66提供一个单刀单掷模拟开关功能。该开关具有两个输入/输出终端(Y和Z)以及一个有源高电平使能输入引脚(E)。E为低电平时,模拟开关会被关断。
使能输入的施密特触发器动作使电路在1.65 V至5.5 V的整个VCC范围内容许较缓慢的输入上升时间和下降时间。
名称/描述 | Modified Date |
---|---|
Bilateral switch (REV 9.0) PDF (294.0 kB) 74LVC1G66 [English] | 15 Jan 2015 |
名称/描述 | Modified Date |
---|---|
Sorting through the low voltage logic maze (REV 1.0) PDF (72.0 kB) AN10156 [English] | 13 Mar 2013 |
Package lead inductance considerations in high-speed applications (REV 1.0) PDF (43.0 kB) AN212 [English] | 13 Mar 2013 |
Pin FMEA for LVC family (REV 1.0) PDF (44.0 kB) AN11009 [English] | 04 Feb 2011 |
MicroPak soldering information (REV 2.0) PDF (245.0 kB) AN10343 [English] | 30 Dec 2010 |
PicoGate Logic footprints (REV 1.0) PDF (87.0 kB) AN10161 [English] | 30 Oct 2002 |
名称/描述 | Modified Date |
---|---|
extremely thin small outline package; no leads; 6 terminals (REV 1.0) PDF (176.0 kB) SOT1115 [English] | 08 Feb 2016 |
XSON6: extremely thin small outline package; no leads; 6 terminals; body 1.0 x 1.0 x 0.35 mm (REV 1.0) PDF (192.0 kB) SOT1202 [English] | 08 Feb 2016 |
plastic thin shrink small outline package; 5 leads; body width 1.25 mm (REV 1.0) PDF (223.0 kB) SOT353-1 [English] | 08 Feb 2016 |
plastic surface-mounted package; 5 leads (REV 1.0) PDF (243.0 kB) SOT753 [English] | 08 Feb 2016 |
XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm (REV 1.0) PDF (189.0 kB) SOT886 [English] | 08 Feb 2016 |
XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1 x 0.5 mm (REV 1.0) PDF (185.0 kB) SOT891 [English] | 08 Feb 2016 |
名称/描述 | Modified Date |
---|---|
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
MAR_SOT1115 Topmark (REV 1.0) PDF (47.0 kB) MAR_SOT1115 [English] | 03 Jun 2013 |
MAR_SOT1202 Topmark (REV 1.0) PDF (49.0 kB) MAR_SOT1202 [English] | 03 Jun 2013 |
MAR_SOT353 Topmark (REV 1.0) PDF (103.0 kB) MAR_SOT353 [English] | 03 Jun 2013 |
MAR_SOT753 Topmark (REV 1.0) PDF (89.0 kB) MAR_SOT753 [English] | 03 Jun 2013 |
MAR_SOT886 Topmark (REV 1.0) PDF (73.0 kB) MAR_SOT886 [English] | 03 Jun 2013 |
MAR_SOT891 Topmark (REV 1.0) PDF (51.0 kB) MAR_SOT891 [English] | 03 Jun 2013 |
型号 | 状态 |
---|---|
74LVC1G66GN | Active |
74LVC1G66GW | Active |
74LVC1G66GM | Active |
74LVC1G66GV | Active |
74LVC1G66GF | Active |
74LVC1G66GS | Active |
产品编号 | 封装说明 | Outline Version | 回流/波峰焊接 | 包装 | 产品状态 | 部件编号订购码 (12NC) | Marking | 化学成分 | RoHS / 无铅 / RHF | 无铅转换日期 | EFR | IFR(FIT) | MTBF(小时) | MSL | MSL LF |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
74LVC1G66GS | SOT1202 | Reel 7" Q1/T1, Q3/T4 | Active | 74LVC1G66GS,132 (9352 929 18132) | VL | 74LVC1G66GS | Always Pb-free | 123.8 | 3.87 | 2.58E8 | 1 | 1 | |||
74LVC1G66GF | SOT891 | Reflow_Soldering_Profile | Reel 7" Q1/T1, Q3/T4 | Active | 74LVC1G66GF,132 (9352 843 07132) | VL | 74LVC1G66GF | Always Pb-free | 123.8 | 3.87 | 2.58E8 | 1 | 1 | ||
74LVC1G66GN | SOT1115 | Reel 7" Q1/T1, Q3/T4 | Active | 74LVC1G66GN,132 (9352 917 91132) | VL | Always Pb-free | 123.8 | 3.87 | 2.58E8 | 1 | 1 | ||||
74LVC1G66GM | SOT886 | Reflow_Soldering_Profile | Reel 7" Q1/T1, Q3/T4 | Active | 74LVC1G66GM,132 (9352 843 06132) | VL | 74LVC1G66GM | Always Pb-free | 123.8 | 3.87 | 2.58E8 | 1 | 1 | ||
Reel 7" Q1/T1 | Active | 74LVC1G66GM,115 (9352 843 06115) | VL | 74LVC1G66GM | Always Pb-free | 123.8 | 3.87 | 2.58E8 | 1 | 1 | |||||
74LVC1G66GV | SOT753 | Reel 7" Q3/T4, Reverse | Active | 74LVC1G66GV,125 (9352 720 34125) | V66 | 74LVC1G66GV | week 36, 2003 | 123.8 | 3.87 | 2.58E8 | 1 | 1 | |||
74LVC1G66GW | SOT353-1 | Reel 7" Q3/T4, Reverse | Active | 74LVC1G66GW,125 (9352 690 58125) | VL | 74LVC1G66GW | week 36, 2003 | 123.8 | 3.87 | 2.58E8 | 1 | 1 | |||
Reel 13" Q3/T4 in LargePack, Reverse | Withdrawn | 74LVC1G66GW,165 (9352 690 58165) | VL | 74LVC1G66GW | week 36, 2003 | 123.8 | 3.87 | 2.58E8 | 1 | 1 |