BAS101: 高压开关二极管
高压开关二极管，采用SOT23小型表面贴装设备（SMD）塑料封装。
BAS101: 产品结构框图
BAS101: 应用结构框图
BAS101: 应用结构框图
SOT023
数据手册 (1)
| 名称/描述 | Modified Date |
|---|---|
| High-voltage switching diodes (REV 2.0) PDF (118.0 kB) BAS101_BAS101S [English] | 23 Dec 2009 |
选型工具指南 (1)
| 名称/描述 | Modified Date |
|---|---|
| Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 [English] | 17 Feb 2016 |
封装信息 (1)
| 名称/描述 | Modified Date |
|---|---|
| plastic surface-mounted package; 3 leads (REV 1.0) PDF (213.0 kB) SOT23 [English] | 08 Feb 2016 |
包装 (1)
| 名称/描述 | Modified Date |
|---|---|
| Tape reel SMD; standard product orientation 12NC ending 215 (REV 1.0) PDF (202.0 kB) SOT23_215 [English] | 16 Nov 2012 |
可靠性与质量信息 (2)
| 名称/描述 | Modified Date |
|---|---|
| BAS101 NXP Product Quality (REV 1.2) PDF (74.0 kB) BAS101_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BAS101 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BAS101_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
支持信息 (2)
| 名称/描述 | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
| Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English] | 30 Sep 2013 |
SPICE
- BAS101 SPICE model (REV 1.4) prm BAS101 7/22/2012
订购信息
| 型号 | 状态 | Package version | Package name | 大小 (mm) | VR max (V) | VR [max] (V) | IFSM max (A) | IFSM [max] (A) | VF [max] (mV) | VFmax (mV) | IR max (nA) | IR [max] (nA) | IFRM (mA) | IFRM (mA) | Configuration | trr [max] (ns) | trr max (ns) | IF [max] (mA) | IF max (mA) | Cd max. (pF) | Cd [max] (pF) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BAS101 | Active | SOT23 | TO-236AB | 2.9 x 1.3 x 1 | 300 | 300 | 9 | 9 | 1100@IF=100mA | 1100@IF=100mA | 150@VR=250V | 150@VR=250V | 1000 | 1000 | single | 50 | 50 | 200 | 200 | 2 | 2 |
| BAS101/T1 | No Longer Manufactured | SOT23 | TO-236AB | 2.9 x 1.3 x 1 | 300 | 300 | 9 | 9 | 1100@IF=100mA | 1100@IF=100mA | 150@VR=250V | 150@VR=250V | 1000 | 1000 | single | 50 | 50 | 200 | 200 | 2 | 2 |
封装环保信息
| 产品编号 | 封装说明 | Outline Version | 回流/波峰焊接 | 包装 | 产品状态 | 部件编号订购码 (12NC) | Marking | 化学成分 | RoHS / 无铅 / RHF | 无铅转换日期 | EFR | IFR(FIT) | MTBF（小时） | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BAS101 | | SOT23 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 7" Q3/T4 | Active | BAS101,215 (9340 608 48215) | %HQ | BAS101 |    | Always Pb-free | 347.0 | 1.61 | 6.21E8 | 1 | 1 |
| BAS101/T1 | | SOT23 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 7" Q3/T4 | Withdrawn | BAS101/T1R (9340 691 65215) | Standard Marking | | Always Pb-free | 347.0 | 1.61 | 6.21E8 | 1 | 1 |
- High-voltage switching diodes BAS101S
- Discretes Semiconductors Selection Guide 2016 BUK7M12-60E
- BAS101 NXP Product Quality BAS101
- BAS101 NXP® Product Reliability BAS101
- BAS101 SPICE model BAS101_BAS101S
- plastic surface-mounted package; 3 leads BSS84AK
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Tape reel SMD; standard product orientation 12NC ending 215 BSS84AK
- TL431_FAMILY
- NUP1301
- PMBD914
- PMBFJ309
