BAW56M: 高速开关二极管
高速开关二极管，采用小型表面贴装设备（SMD）塑料封装。
SOT883
数据手册 (1)
| 名称/描述 | Modified Date |
|---|---|
| High-speed switching diodes (REV 6.0) PDF (370.0 kB) BAV756S_BAW56_SER [English] | 18 Mar 2015 |
选型工具指南 (1)
| 名称/描述 | Modified Date |
|---|---|
| Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 [English] | 17 Feb 2016 |
封装信息 (1)
| 名称/描述 | Modified Date |
|---|---|
| DFN1006-3: leadless ultra small plastic package; 3 solder lands (REV 1.0) PDF (181.0 kB) SOT883 [English] | 08 Feb 2016 |
包装 (1)
| 名称/描述 | Modified Date |
|---|---|
| Leadless ultra small package; Reel pack, SMD, 7" Q1/T1 standard product orientation Orderable part number ending... (REV 2.0) PDF (150.0 kB) SOT883_315 [English] | 22 Jul 2016 |
可靠性与质量信息 (2)
| 名称/描述 | Modified Date |
|---|---|
| BAW56M NXP Product Quality (REV 1.2) PDF (74.0 kB) BAW56M_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BAW56M NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BAW56M_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
支持信息 (1)
| 名称/描述 | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
Design Support
- LSYMDIO_1 (REV 0.1) PDF LSYMDIO_1 5/1/1999
SPICE
- BAW56M SPICE model (REV 1.4) prm BAW56M 7/22/2012
订购信息
| 型号 | 状态 | Package version | Package name | 大小 (mm) | VR [max] (V) | VR max (V) | IFSM max (A) | IFSM [max] (A) | VF [max] (mV) | VFmax (mV) | IR max (nA) | IR [max] (nA) | IFRM (mA) | IFRM (mA) | Configuration | trr max (ns) | trr [max] (ns) | IF max (mA) | IF [max] (mA) | Cd [max] (pF) | Cd max. (pF) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BAW56M | Active | SOT883 | DFN1006-3 | 1.0 x 0.6 x 0.5 | 90 | 90 | 5 | 5 | 1250@IF=150mA | 1250@IF=150mA | 0.5@VR=80V | 500@VR=80V | 500 | 500 | dual c.a. | 4 | 4 | 150 | 150 | 2 | 2 |
封装环保信息
| 产品编号 | 封装说明 | Outline Version | 回流/波峰焊接 | 包装 | 产品状态 | 部件编号订购码 (12NC) | Marking | 化学成分 | RoHS / 无铅 / RHF | 无铅转换日期 | EFR | IFR(FIT) | MTBF（小时） | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BAW56M | | SOT883 | Reflow_Soldering_Profile | Reel 7" Q1/T1 Pitch 2mm | Active | BAW56M,315 (9340 612 71315) | S5 | BAW56M |    | Always Pb-free | 347.0 | 1.61 | 6.21E8 | 1 | 1 |
- High-speed switching diodes BAW56W
- Discretes Semiconductors Selection Guide 2016 BUK7M12-60E
- BAW56M NXP Product Quality BAW56M
- BAW56M NXP® Product Reliability BAW56M
- LSYMDIO_1 BAW56W
- BAW56M SPICE model BAW56M
- DFN1006-3: leadless ultra small plastic package; 3 solder lands BSS84AKM
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Leadless ultra small package; Reel pack, SMD, 7" Q1/T1 standard product orientation Orderable part number ending... BSS84AKM
- PMZ950UPE
