BC846BM: 65 V, 100 mA NPN general-purpose transistor
NPN general-purpose transistor in a leadless ultra small DFN1006-3 (SOT883) Surface-Mounted Device (SMD) plastic package.
PNP complement: BC856BM.
SOT883
数据手册 (1)
| 名称/描述 | Modified Date |
|---|---|
| 65 V, 100 mA NPN general-purpose transistor (REV 1.0) PDF (165.0 kB) BC846BM [English] | 20 Aug 2015 |
封装信息 (1)
| 名称/描述 | Modified Date |
|---|---|
| DFN1006-3: leadless ultra small plastic package; 3 solder lands (REV 1.0) PDF (181.0 kB) SOT883 [English] | 08 Feb 2016 |
包装 (1)
| 名称/描述 | Modified Date |
|---|---|
| Leadless ultra small package; Reel pack, SMD, 7" Q1/T1 standard product orientation Orderable part number ending... (REV 2.0) PDF (150.0 kB) SOT883_315 [English] | 22 Jul 2016 |
可靠性与质量信息 (2)
| 名称/描述 | Modified Date |
|---|---|
| BC846BM NXP Product Quality (REV 1.2) PDF (74.0 kB) BC846BM_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BC846BM NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BC846BM_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
支持信息 (1)
| 名称/描述 | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
SPICE
- BC846BM SPICE model (REV 1.0) TXT BC846BM_1 8/21/2015
订购信息
| 型号 | 状态 | Package version | Package name | 大小 (mm) | Ptot (mW) | Configuration | VCEO [max] (V) | IC max (mA) | hFE [min] | hFE max | hFE [max] | fT [min] (MHz) | fr [min] (MHz) | Polarity | Complement | IC [max] (mA) | Ptot [max] (mW) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BC846BM | Active | SOT883 | DFN1006-3 | 1.0 x 0.6 x 0.5 | 250 | 1 | 65 | 200 | 450 | 100 | NPN | 100 |
封装环保信息
| 产品编号 | 封装说明 | Outline Version | 回流/波峰焊接 | 包装 | 产品状态 | 部件编号订购码 (12NC) | Marking | 化学成分 | RoHS / 无铅 / RHF | 无铅转换日期 | EFR | IFR(FIT) | MTBF（小时） | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BC846BM | | SOT883 | Reflow_Soldering_Profile | Reel 7" Q1/T1 Pitch 2mm | Active | BC846BM,315 (9340 663 22315) | ZB | BC846BM |    | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
- BC846BM NXP Product Quality BC846BM
- BC846BM NXP® Product Reliability BC846BM
- BC846BM SPICE model BC846BM
- DFN1006-3: leadless ultra small plastic package; 3 solder lands BSS84AKM
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Leadless ultra small package; Reel pack, SMD, 7" Q1/T1 standard product orientation Orderable part number ending... BSS84AKM
- PMZ950UPE
