BC846BPN: 65 V，100 mA NPN/PNP通用晶体管
NPN/PNP通用晶体管对，采用超小型表面贴装器件(SMD)塑料封装。
BC846BPN: 产品结构框图
BC846BPN: 应用结构框图
SOT363
数据手册 (1)
| 名称/描述 | Modified Date |
|---|---|
| 65 V, 100 mA NPN/PNP general-purpose transistor (REV 1.0) PDF (130.0 kB) BC846BPN [English] | 21 Jul 2009 |
封装信息 (1)
| 名称/描述 | Modified Date |
|---|---|
| plastic surface-mounted package; 6 leads (REV 1.0) PDF (246.0 kB) SOT363_1 [English] | 08 Feb 2016 |
包装 (1)
| 名称/描述 | Modified Date |
|---|---|
| TSSOP6; Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (187.0 kB) SOT363_115 [English] | 15 Nov 2012 |
可靠性与质量信息 (2)
| 名称/描述 | Modified Date |
|---|---|
| BC846BPN NXP Product Quality (REV 1.2) PDF (74.0 kB) BC846BPN_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BC846BPN NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BC846BPN_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
支持信息 (3)
| 名称/描述 | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
| Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English] | 30 Sep 2013 |
| MAR_SOT363 Topmark (REV 1.0) PDF (104.0 kB) MAR_SOT363 [English] | 03 Jun 2013 |
Design Support
- Letter Symbols - Transistors; General (REV 0.1) PDF LSYMTRA_1 5/7/1999
SPICE
- BC846BPN_NPN SPICE model (REV 1.4) prm BC846BPN_NPN 7/22/2012
订购信息
| 型号 | 状态 | Package version | Package name | 大小 (mm) | Ptot (mW) | Configuration | VCEO [max] (V) | IC max (mA) | hFE [min] | hFE max | IC [max] (mA) | hFE [max] | fT [min] (MHz) | fr [min] (MHz) | Polarity | Complement |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BC846BPN/ZL | Active | SOT363 | TSSOP6 | 2 x 1.25 x 0.95 | 300 | 2 | 65 | 200 | 100 | 450 | 100 | NPN/PNP | ||||
| BC846BPN | Active | SOT363 | TSSOP6 | 2 x 1.25 x 0.95 | 300 | 2 | 65 | 200 | 100 | 450 | 100 | NPN/PNP |
封装环保信息
| 产品编号 | 封装说明 | Outline Version | 回流/波峰焊接 | 包装 | 产品状态 | 部件编号订购码 (12NC) | Marking | 化学成分 | RoHS / 无铅 / RHF | 无铅转换日期 | EFR | IFR(FIT) | MTBF（小时） | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BC846BPN | | SOT363 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 7" Q1/T1 | Active | BC846BPN,115 (9340 634 71115) | PJ% | BC846BPN |    | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
| BC846BPN/ZL | | SOT363 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 7" Q1/T1 | Active | BC846BPN/ZLX (9340 697 87115) | Standard Marking | BC846BPN/ZL | | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
- BC846BPN NXP Product Quality BC846BPN
- BC846BPN NXP® Product Reliability BC846BPN
- MAR_SOT363 Topmark BSS84AKS
- Letter Symbols - Transistors; General PEMD16
- BC846BPN_NPN SPICE model BC846BPN
- plastic surface-mounted package; 6 leads BSS84AKS
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- TSSOP6; Tape reel SMD; standard product orientation 12NC ending 115 BSS84AKS
- BAV99_SERIES
- PBSS4160DPN
- BFU520Y
