BC868: 20 V，2 A NPN中等功率晶体管
NPN中等功率晶体管，采用SOT89表面贴装器件(SMD)塑料封装。PNP补充产品：BC869。
SOT089
数据手册 (1)
| 名称/描述 | Modified Date |
|---|---|
| 20 V, 2A NPN medium power transistors (REV 8.0) PDF (1.2 MB) BCP68_BC868_BC68PA [English] | 02 Nov 2011 |
手册 (1)
| 名称/描述 | Modified Date |
|---|---|
| Medium-power general-purpose transistors (REV 1.0) PDF (892.0 kB) 75017660 [English] | 26 May 2015 |
封装信息 (1)
| 名称/描述 | Modified Date |
|---|---|
| plastic surface-mounted package; die pad for good heat transfer; 3 leads (REV 1.0) PDF (193.0 kB) SOT89 [English] | 08 Feb 2016 |
包装 (1)
| 名称/描述 | Modified Date |
|---|---|
| Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (178.0 kB) SOT89_115 [English] | 28 Nov 2012 |
可靠性与质量信息 (2)
| 名称/描述 | Modified Date |
|---|---|
| BC868 NXP Product Quality (REV 1.2) PDF (74.0 kB) BC868_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BC868 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BC868_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
Design Support
- Letter Symbols - Transistors; General (REV 0.1) PDF LSYMTRA_1 5/7/1999
- Power Derating Curves for SMDs; General (REV 0.1) PDF DERATSMD_1 5/7/1999
SPICE
- BC868 SPICE model (REV 1.4) prm BC868 7/22/2012
订购信息
| 型号 | 状态 | Package version | Package name | 大小 (mm) | Ptot (mW) | Complement | IC [max] (mA) | IC max (mA) | Polarity | Ptot [max] (mW) | VCEO [max] (V) | hFE max | fT [min] (MHz) | hFE [max] | hFE [min] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BC868 | Active | SOT89 | SOT89 | 4.5 x 2.5 x 1.5 | BC869 | 2000 | NPN | 1350 | 20 | 145 | 375 | 40 |
封装环保信息
| 产品编号 | 封装说明 | Outline Version | 回流/波峰焊接 | 包装 | 产品状态 | 部件编号订购码 (12NC) | Marking | 化学成分 | RoHS / 无铅 / RHF | 无铅转换日期 | EFR | IFR(FIT) | MTBF（小时） | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BC868 | | SOT89 | Reel 7" Q1/T1 | Active | BC868,115 (9336 787 70115) | CAC | BC868 |    | week 28, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
- Medium-power general-purpose transistors BSR43
- BC868 NXP Product Quality BC868
- BC868 NXP® Product Reliability BC868
- Letter Symbols - Transistors; General PEMD16
- Power Derating Curves for SMDs; General BST62
- BC868 SPICE model BCP68_BC868_BC68PA
- plastic surface-mounted package; die pad for good heat transfer; 3 leads BZV49-C9V1
- Tape reel SMD; standard product orientation 12NC ending 115 BZV49-C9V1
- BFU590Q
