BCP52-10: 60 V，1 A PNP中等功率晶体管
PNP中等功率晶体管，采用SOT223表面贴装器件(SMD)塑料封装。NPN补充产品：BCP55。
SOT223
数据手册 (1)
| 名称/描述 | Modified Date |
|---|---|
| 60 V, 1 A PNP medium power transistors (REV 9.0) PDF (1.1 MB) BCP52_BCX52_BC52PA [English] | 07 Nov 2011 |
应用说明 (1)
| 名称/描述 | Modified Date |
|---|---|
| Increased circuit efficiency, less required board space and saved money by replacing power transistors with low VCEsat... (REV 1.0) PDF (400.0 kB) AN10405 [English] | 06 Jan 2006 |
手册 (1)
| 名称/描述 | Modified Date |
|---|---|
| Medium-power general-purpose transistors (REV 1.0) PDF (892.0 kB) 75017660 [English] | 26 May 2015 |
封装信息 (1)
| 名称/描述 | Modified Date |
|---|---|
| plastic surface-mounted package with increased heatsink; 4 leads (REV 1.0) PDF (198.0 kB) SOT223 [English] | 08 Feb 2016 |
包装 (1)
| 名称/描述 | Modified Date |
|---|---|
| Tape reel SMD; standard product orientation 12NC ending 135 (REV 1.0) PDF (189.0 kB) SOT223_135 [English] | 07 Nov 2012 |
可靠性与质量信息 (2)
| 名称/描述 | Modified Date |
|---|---|
| BCP52-10 NXP Product Quality (REV 1.2) PDF (74.0 kB) BCP52-10_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BCP52-10 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BCP52-10_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
支持信息 (2)
| 名称/描述 | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
| Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English] | 30 Sep 2013 |
Design Support
- Letter Symbols - Transistors; General (REV 0.1) PDF LSYMTRA_1 5/7/1999
SPICE
- BCP52-10 SPICE model (REV 1.4) prm BCP52-10 7/22/2012
订购信息
| 型号 | 状态 | Package version | Package name | 大小 (mm) | Complement | Ptot (mW) | IC [max] (mA) | Polarity | IC max (mA) | Ptot [max] (mW) | VCEO [max] (V) | hFE max | fT [min] (MHz) | hFE [max] | hFE [min] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BCP52-10 | Active | SOT223 | SC-73 | 6.5 x 3.5 x 1.65 | BCP55-10 | 1000 | PNP | 1350 | 60 | 145 | 160 | 63 |
封装环保信息
| 产品编号 | 封装说明 | Outline Version | 回流/波峰焊接 | 包装 | 产品状态 | 部件编号订购码 (12NC) | Marking | 化学成分 | RoHS / 无铅 / RHF | 无铅转换日期 | EFR | IFR(FIT) | MTBF（小时） | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BCP52-10 | | SOT223 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 11¼" Q1/T1 in LargePack | Active | BCP52-10,135 (9339 173 10135) | BCP52/10 | BCP52-10 |    | week 34, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
- Increased circuit efficiency, less required board space and saved money by replacing power transistors with low VCEsat... BCX56-16
- Medium-power general-purpose transistors BSR43
- BCP52-10 NXP Product Quality BCP52-10
- BCP52-10 NXP® Product Reliability BCP52-10
- Letter Symbols - Transistors; General PEMD16
- BCP52-10 SPICE model BCP52-10
- plastic surface-mounted package with increased heatsink; 4 leads BUK7880-55A
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Tape reel SMD; standard product orientation 12NC ending 135 BUK7880-55
- BLT81
