BCP53; BCX53; BC53PA: 80 V，1 A PNP中等功率晶体管
PNP中等功率晶体管系列，采用表面贴装器件(SMD)塑料封装。
SOT089
数据手册 (1)
| 名称/描述 | Modified Date |
|---|---|
| 80 V, 1 A PNP medium power transistors (REV 9.0) PDF (1.1 MB) BCP53_BCX53_BC53PA [English] | 01 Aug 2016 |
应用说明 (1)
| 名称/描述 | Modified Date |
|---|---|
| Increased circuit efficiency, less required board space and saved money by replacing power transistors with low VCEsat... (REV 1.0) PDF (400.0 kB) AN10405 [English] | 06 Jan 2006 |
手册 (1)
| 名称/描述 | Modified Date |
|---|---|
| Medium-power general-purpose transistors (REV 1.0) PDF (892.0 kB) 75017660 [English] | 26 May 2015 |
封装信息 (3)
| 名称/描述 | Modified Date |
|---|---|
| DFN2020-3: plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 2 x 2 x 0.65 mm (REV 1.0) PDF (185.0 kB) SOT1061 [English] | 08 Feb 2016 |
| plastic surface-mounted package with increased heatsink; 4 leads (REV 1.0) PDF (198.0 kB) SOT223 [English] | 08 Feb 2016 |
| plastic surface-mounted package; die pad for good heat transfer; 3 leads (REV 1.0) PDF (193.0 kB) SOT89 [English] | 08 Feb 2016 |
包装 (6)
| 名称/描述 | Modified Date |
|---|---|
| Reel pack, SMD, 7" T3 Turned 270 degree product orientation Ordering code (12NC) ending 146 (REV 1.0) PDF (134.0 kB) SOT89_146 [English] | 04 Mar 2014 |
| Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (178.0 kB) SOT89_115 [English] | 28 Nov 2012 |
| Tape reel SMD; standard product orientation 12NC ending 135 (REV 1.0) PDF (178.0 kB) SOT89_135 [English] | 28 Nov 2012 |
| DFN2020-3; reel pack; standard product orientation; 12NC ending 115 (REV 1.0) PDF (261.0 kB) SOT1061_115 [English] | 07 Nov 2012 |
| Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (189.0 kB) SOT223_115 [English] | 07 Nov 2012 |
| Tape reel SMD; standard product orientation 12NC ending 135 (REV 1.0) PDF (189.0 kB) SOT223_135 [English] | 07 Nov 2012 |
可靠性与质量信息 (18)
| 名称/描述 | Modified Date |
|---|---|
| BC53-10PA NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BC53-10PA [English] | 31 Jan 2015 |
| BC53-10PA NXP Product Quality (REV 1.2) PDF (74.0 kB) BC53-10PA_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BC53-16PA NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BC53-16PA [English] | 31 Jan 2015 |
| BC53-16PA NXP Product Quality (REV 1.2) PDF (74.0 kB) BC53-16PA_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BC53PA NXP Product Quality (REV 1.2) PDF (74.0 kB) BC53PA_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BC53PA NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BC53PA_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
| BCP53-10 NXP Product Quality (REV 1.2) PDF (74.0 kB) BCP53-10_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BCP53-10 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BCP53-10_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
| BCP53-16 NXP Product Quality (REV 1.2) PDF (74.0 kB) BCP53-16_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BCP53-16 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BCP53-16_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
| BCP53 NXP Product Quality (REV 1.2) PDF (74.0 kB) BCP53_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BCP53 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BCP53_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
| BCX53-10 NXP Product Quality (REV 1.2) PDF (74.0 kB) BCX53-10_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BCX53-10 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BCX53-10_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
| BCX53-16 NXP Product Quality (REV 1.2) PDF (74.0 kB) BCX53-16_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BCX53-16 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BCX53-16_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
| BCX53 NXP Product Quality (REV 1.2) PDF (74.0 kB) BCX53_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BCX53 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BCX53_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
支持信息 (2)
| 名称/描述 | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
| Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English] | 30 Sep 2013 |
Design Support
- Letter Symbols - Transistors; General (REV 0.1) PDF LSYMTRA_1 5/7/1999
SPICE
- BC53-10PA SPICE model (REV 1.4) prm BC53-10PA_1 7/22/2012
- BC53-16PA SPICE model (REV 1.4) prm BC53-16PA_1 7/22/2012
- BC53PA SPICE model (REV 1.4) prm BC53PA 7/22/2012
- BCP53 SPICE model (REV 1.4) prm BCP53 7/22/2012
- BCP53-10 SPICE model (REV 1.4) prm BCP53-10 7/22/2012
- BCP53-16 SPICE model (REV 1.4) prm BCP53-16 7/22/2012
- BCX53 SPICE model (REV 1.4) prm BCX53 7/22/2012
- BCX53-10 SPICE model (REV 1.4) prm BCX53-10 7/22/2012
- BCX53-16 SPICE model (REV 1.4) prm BCX53-16 7/22/2012
订购信息
| 型号 | 状态 |
|---|---|
| BC53-16PA | Active |
| BCX53 | Active |
| BCP53-10 | Active |
| BCP53 | Active |
| BCP53-16 | Active |
| BC53-10PA | Active |
| BC53PA | Active |
| BCX53-10 | Active |
| BCX53-16 | Active |
封装环保信息
| 产品编号 | 封装说明 | Outline Version | 回流/波峰焊接 | 包装 | 产品状态 | 部件编号订购码 (12NC) | Marking | 化学成分 | RoHS / 无铅 / RHF | 无铅转换日期 | EFR | IFR(FIT) | MTBF（小时） | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BCX53-10 | | SOT89 | Reel 11¼" Q1/T1 in LargePack | Active | BCX53-10,135 (9336 630 60135) | AK | BCX53-10 |    | week 28, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 | |
| Reel 7" Q1/T1 | Active | BCX53-10,115 (9336 630 60115) | AK | BCX53-10 | | week 28, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 | ||||
| BC53-16PA |  | SOT1061 | Reflow_Soldering_Profile | Reel 7" Q1/T1 | Active | BC53-16PA,115 (9340 658 23115) | BX | BC53-16PA | | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
| BCP53-10 |  | SOT223 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 11¼" Q1/T1 in LargePack | Active | BCP53-10,135 (9339 173 40135) | BCP53/10 | BCP53-10 | | week 34, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
| Reel 7" Q1/T1 | Active | BCP53-10,115 (9339 173 40115) | BCP53/10 | BCP53-10 | | week 34, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 | ||||
| BCX53 | | SOT89 | Reel 7" Q1/T1 | Active | BCX53,115 (9332 723 00115) | AH | BCX53 | | week 28, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 | |
| Reel 7" Q4/T2 | Active | BCX53,146 (9332 723 00146) | AH | BCX53 | | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 | ||||
| BC53-10PA | | SOT1061 | Reflow_Soldering_Profile | Reel 7" Q1/T1 | Active | BC53-10PA,115 (9340 658 22115) | BW | BC53-10PA | | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
| BCP53-16 | | SOT223 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 11¼" Q1/T1 in LargePack | Active | BCP53-16,135 (9339 173 50135) | BCP53/16 | BCP53-16 | | week 34, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
| Reel 7" Q1/T1 | Active | BCP53-16,115 (9339 173 50115) | BCP53/16 | BCP53-16 | | week 34, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 | ||||
| BCX53-16 | | SOT89 | Reel 7" Q1/T1 | Active | BCX53-16,115 (9336 747 30115) | AL | BCX53-16 | | week 28, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 | |
| Reel 7" Q4/T2 | Active | BCX53-16,146 (9336 747 30146) | AL | BCX53-16 | | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 | ||||
| Reel 11¼" Q1/T1 in LargePack | Active | BCX53-16,135 (9336 747 30135) | AL | BCX53-16 | | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 | ||||
| BCP53 | | SOT223 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 7" Q1/T1 | Active | BCP53,115 (9339 173 30115) | BCP53 | BCP53 | | week 34, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
| BC53PA | | SOT1061 | Reflow_Soldering_Profile | Reel 7" Q1/T1 | Active | BC53PA,115 (9340 658 21115) | BV | BC53PA | | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
- Increased circuit efficiency, less required board space and saved money by replacing power transistors with low VCEsat... BCX56-16
- Medium-power general-purpose transistors BSR43
- BC53-10PA NXP® Product Reliability BC53-10PA
- BC53-10PA NXP Product Quality BC53-10PA
- BC53-16PA NXP® Product Reliability BC53-16PA
- BC53-16PA NXP Product Quality BC53-16PA
- BC53PA NXP Product Quality BC53PA
- BC53PA NXP® Product Reliability BC53PA
- BCP53-10 NXP Product Quality BCP53-10
- BCP53-10 NXP® Product Reliability BCP53-10
- BCP53-16 NXP Product Quality BCP53-16
- BCP53-16 NXP® Product Reliability BCP53-16
- BCP53 NXP Product Quality BCP53
- BCP53 NXP® Product Reliability BCP53
- BCX53-10 NXP Product Quality BCX53-10
- BCX53-10 NXP® Product Reliability BCX53-10
- BCX53-16 NXP Product Quality BCX53-16
- BCX53-16 NXP® Product Reliability BCX53-16
- BCX53 NXP Product Quality BCX53
- BCX53 NXP® Product Reliability BCX53
- Letter Symbols - Transistors; General PEMD16
- BC53-10PA SPICE model BCP53_BCX53_BC53PA
- BC53-16PA SPICE model BCP53_BCX53_BC53PA
- BC53PA SPICE model BCP53_BCX53_BC53PA
- BCP53 SPICE model BCP53_BCX53_BC53PA
- BCP53-10 SPICE model BCP53-10
- BCP53-16 SPICE model BCP53-16
- BCX53 SPICE model BCX53
- BCX53-10 SPICE model BCX53-10
- BCX53-16 SPICE model BCX53-16
- Tape reel SMD; standard product orientation 12NC ending 135 BUK7880-55
- plastic surface-mounted package; die pad for good heat transfer; 3 leads BZV49-C9V1
- Tape reel SMD; standard product orientation 12NC ending 115 BZV49-C9V1
- Reel pack, SMD, 7" T3 Turned 270 degree product orientation Ordering code (12NC) ending 146 BCX53-16
- Tape reel SMD; standard product orientation 12NC ending 135 BZV49-C4V3
- plastic surface-mounted package with increased heatsink; 4 leads BUK7880-55A
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Tape reel SMD; standard product orientation 12NC ending 115 BUK7880-55A
- DFN2020-3: plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 2 x 2 x 0.65 mm PMEG6020EPA
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- DFN2020-3; reel pack; standard product orientation; 12NC ending 115 PMEG6020EPA
- BFU590Q
- BLT81
- PTVSXU1UPA_SERIES
