BCP55; BCX55; BC55PA: 60 V，1 A NPN中等功率晶体管
NPN中等功率晶体管系列，采用表面贴装器件(SMD)塑料封装。
SOT089
数据手册 (1)
| 名称/描述 | Modified Date |
|---|---|
| 60 V, 1 A NPN medium power transistors (REV 8.0) PDF (1.2 MB) BCP55_BCX55_BC55PA [English] | 10 Nov 2011 |
应用说明 (1)
| 名称/描述 | Modified Date |
|---|---|
| Increased circuit efficiency, less required board space and saved money by replacing power transistors with low VCEsat... (REV 1.0) PDF (400.0 kB) AN10405 [English] | 06 Jan 2006 |
手册 (1)
| 名称/描述 | Modified Date |
|---|---|
| Medium-power general-purpose transistors (REV 1.0) PDF (892.0 kB) 75017660 [English] | 26 May 2015 |
封装信息 (3)
| 名称/描述 | Modified Date |
|---|---|
| DFN2020-3: plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 2 x 2 x 0.65 mm (REV 1.0) PDF (185.0 kB) SOT1061 [English] | 08 Feb 2016 |
| plastic surface-mounted package with increased heatsink; 4 leads (REV 1.0) PDF (198.0 kB) SOT223 [English] | 08 Feb 2016 |
| plastic surface-mounted package; die pad for good heat transfer; 3 leads (REV 1.0) PDF (193.0 kB) SOT89 [English] | 08 Feb 2016 |
包装 (5)
| 名称/描述 | Modified Date |
|---|---|
| Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (178.0 kB) SOT89_115 [English] | 28 Nov 2012 |
| Tape reel SMD; standard product orientation 12NC ending 135 (REV 1.0) PDF (178.0 kB) SOT89_135 [English] | 28 Nov 2012 |
| DFN2020-3; reel pack; standard product orientation; 12NC ending 115 (REV 1.0) PDF (261.0 kB) SOT1061_115 [English] | 07 Nov 2012 |
| Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (189.0 kB) SOT223_115 [English] | 07 Nov 2012 |
| Tape reel SMD; standard product orientation 12NC ending 135 (REV 1.0) PDF (189.0 kB) SOT223_135 [English] | 07 Nov 2012 |
可靠性与质量信息 (18)
| 名称/描述 | Modified Date |
|---|---|
| BC55-10PA NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BC55-10PA [English] | 31 Jan 2015 |
| BC55-10PA NXP Product Quality (REV 1.2) PDF (74.0 kB) BC55-10PA_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BC55-16PA NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BC55-16PA [English] | 31 Jan 2015 |
| BC55-16PA NXP Product Quality (REV 1.2) PDF (74.0 kB) BC55-16PA_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BC55PA NXP Product Quality (REV 1.2) PDF (74.0 kB) BC55PA_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BC55PA NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BC55PA_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
| BCP55-10 NXP Product Quality (REV 1.2) PDF (74.0 kB) BCP55-10_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BCP55-10 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BCP55-10_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
| BCP55-16 NXP Product Quality (REV 1.2) PDF (74.0 kB) BCP55-16_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BCP55-16 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BCP55-16_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
| BCP55 NXP Product Quality (REV 1.2) PDF (74.0 kB) BCP55_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BCP55 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BCP55_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
| BCX55-10 NXP Product Quality (REV 1.2) PDF (74.0 kB) BCX55-10_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BCX55-10 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BCX55-10_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
| BCX55-16 NXP Product Quality (REV 1.2) PDF (74.0 kB) BCX55-16_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BCX55-16 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BCX55-16_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
| BCX55 NXP Product Quality (REV 1.2) PDF (74.0 kB) BCX55_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BCX55 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BCX55_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
支持信息 (2)
| 名称/描述 | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
| Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English] | 30 Sep 2013 |
Design Support
- Letter Symbols - Transistors; General (REV 0.1) PDF LSYMTRA_1 5/7/1999
SPICE
- BC55-10PA SPICE model (REV 1.4) prm BC55-10PA_1 7/22/2012
- BC55-16PA SPICE model (REV 1.4) prm BC55-16PA_1 7/22/2012
- BC55PA SPICE model (REV 1.4) prm BC55PA 7/22/2012
- BCP55 SPICE model (REV 1.4) prm BCP55 7/22/2012
- BCP55-10 SPICE model (REV 1.4) prm BCP55-10 7/22/2012
- BCP55-16 SPICE model (REV 1.4) prm BCP55-16 7/22/2012
- BCX55 SPICE model (REV 1.4) prm BCX55 7/22/2012
- BCX55-10 SPICE model (REV 1.4) prm BCX55-10 7/22/2012
- BCX55-16 SPICE model (REV 1.4) prm BCX55-16 7/22/2012
订购信息
| 型号 | 状态 |
|---|---|
| BCP55-16 | Active |
| BCX55-16 | Active |
| BC55-16PA | Active |
| BCP55-10 | Active |
| BCP55 | Active |
| BCX55-10 | Active |
| BC55-10PA | Active |
| BCX55 | Active |
| BC55PA | Active |
封装环保信息
| 产品编号 | 封装说明 | Outline Version | 回流/波峰焊接 | 包装 | 产品状态 | 部件编号订购码 (12NC) | Marking | 化学成分 | RoHS / 无铅 / RHF | 无铅转换日期 | EFR | IFR(FIT) | MTBF（小时） | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BC55PA |  | SOT1061 | Reflow_Soldering_Profile | Reel 7" Q1/T1 | Active | BC55PA,115 (9340 657 42115) | AW | BC55PA |    | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
| BCX55-10 | | SOT89 | Reel 7" Q1/T1 | Active | BCX55-10,115 (9336 630 80115) | BG | BCX55-10 | | week 28, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 | |
| BCP55 |  | SOT223 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 11¼" Q1/T1 in LargePack | Active | BCP55,135 (9339 172 10135) | BCP55 | BCP55 | | week 34, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
| Reel 7" Q1/T1 | Active | BCP55,115 (9339 172 10115) | BCP55 | BCP55 | | week 34, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 | ||||
| BCP55-10 | | SOT223 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 7" Q1/T1 | Active | BCP55-10,115 (9339 172 20115) | BCP55/10 | BCP55-10 | | week 34, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
| BCX55 | | SOT89 | Reel 7" Q1/T1 | Active | BCX55,115 (9332 723 20115) | BE | BCX55 | | week 28, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 | |
| Reel 11¼" Q1/T1 in LargePack | Active | BCX55,135 (9332 723 20135) | BE | BCX55 |  | 153.0 | 0.71 | 1.41E9 | NA | NA | |||||
| BCX55-16 | | SOT89 | Reel 11¼" Q1/T1 in LargePack | Active | BCX55-16,135 (9336 747 50135) | BM | BCX55-16 | | week 28, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 | |
| Reel 7" Q1/T1 | Active | BCX55-16,115 (9336 747 50115) | BM | BCX55-16 | | week 28, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 | ||||
| BCP55-16 | | SOT223 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 11¼" Q1/T1 in LargePack | Active | BCP55-16F (9339 172 30135) | BCP55/16 | BCP55-16 | | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
| Reel 7" Q1/T1 | Active | BCP55-16,115 (9339 172 30115) | BCP55/16 | BCP55-16 | | week 34, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 | ||||
| BC55-10PA | | SOT1061 | Reflow_Soldering_Profile | Reel 7" Q1/T1 | Active | BC55-10PA,115 (9340 658 07115) | BH | BC55-10PA | | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
| BC55-16PA | | SOT1061 | Reflow_Soldering_Profile | Reel 7" Q1/T1 | Active | BC55-16PA,115 (9340 658 08115) | BJ | BC55-16PA | | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
- Increased circuit efficiency, less required board space and saved money by replacing power transistors with low VCEsat... BCX56-16
- Medium-power general-purpose transistors BSR43
- BC55-10PA NXP® Product Reliability BC55-10PA
- BC55-10PA NXP Product Quality BC55-10PA
- BC55-16PA NXP® Product Reliability BC55-16PA
- BC55-16PA NXP Product Quality BC55-16PA
- BC55PA NXP Product Quality BC55PA
- BC55PA NXP® Product Reliability BC55PA
- BCP55-10 NXP Product Quality BCP55-10
- BCP55-10 NXP® Product Reliability BCP55-10
- BCP55-16 NXP Product Quality BCP55-16
- BCP55-16 NXP® Product Reliability BCP55-16
- BCP55 NXP Product Quality BCP55
- BCP55 NXP® Product Reliability BCP55
- BCX55-10 NXP Product Quality bcx55-10
- BCX55-10 NXP® Product Reliability bcx55-10
- BCX55-16 NXP Product Quality BCX55-16
- BCX55-16 NXP® Product Reliability BCX55-16
- BCX55 NXP Product Quality BCX55
- BCX55 NXP® Product Reliability BCX55
- Letter Symbols - Transistors; General PEMD16
- BC55-10PA SPICE model BCP55_BCX55_BC55PA
- BC55-16PA SPICE model BCP55_BCX55_BC55PA
- BC55PA SPICE model BCP55_BCX55_BC55PA
- BCP55 SPICE model BCP55_BCX55_BC55PA
- BCP55-10 SPICE model BCP55-10
- BCP55-16 SPICE model BCP55-16
- BCX55 SPICE model BCX55
- BCX55-10 SPICE model BCX55-10
- BCX55-16 SPICE model BCX55-16
- plastic surface-mounted package; die pad for good heat transfer; 3 leads BZV49-C9V1
- Tape reel SMD; standard product orientation 12NC ending 135 BZV49-C4V3
- Tape reel SMD; standard product orientation 12NC ending 115 BZV49-C9V1
- plastic surface-mounted package with increased heatsink; 4 leads BUK7880-55A
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Tape reel SMD; standard product orientation 12NC ending 135 BUK7880-55
- Tape reel SMD; standard product orientation 12NC ending 115 BUK7880-55A
- DFN2020-3: plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 2 x 2 x 0.65 mm PMEG6020EPA
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- DFN2020-3; reel pack; standard product orientation; 12NC ending 115 PMEG6020EPA
- BFU590Q
- BLT81
- PTVSXU1UPA_SERIES
