BCP56: 80 V，1 A NPN中等功率晶体管
NPN中等功率晶体管，采用SOT223表面贴装器件(SMD)塑料封装。PNP补充产品：BCP53。
SOT223
数据手册 (1)
| 名称/描述 | Modified Date |
|---|---|
| 80 V, 1 A NPN medium power transistors (REV 9.0) PDF (1.1 MB) BCP56_BCX56_BC56PA [English] | 07 Nov 2011 |
应用说明 (1)
| 名称/描述 | Modified Date |
|---|---|
| Increased circuit efficiency, less required board space and saved money by replacing power transistors with low VCEsat... (REV 1.0) PDF (400.0 kB) AN10405 [English] | 06 Jan 2006 |
手册 (1)
| 名称/描述 | Modified Date |
|---|---|
| Medium-power general-purpose transistors (REV 1.0) PDF (892.0 kB) 75017660 [English] | 26 May 2015 |
封装信息 (1)
| 名称/描述 | Modified Date |
|---|---|
| plastic surface-mounted package with increased heatsink; 4 leads (REV 1.0) PDF (198.0 kB) SOT223 [English] | 08 Feb 2016 |
包装 (2)
| 名称/描述 | Modified Date |
|---|---|
| Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (189.0 kB) SOT223_115 [English] | 07 Nov 2012 |
| Tape reel SMD; standard product orientation 12NC ending 135 (REV 1.0) PDF (189.0 kB) SOT223_135 [English] | 07 Nov 2012 |
可靠性与质量信息 (2)
| 名称/描述 | Modified Date |
|---|---|
| BCP56 NXP Product Quality (REV 1.2) PDF (74.0 kB) BCP56_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BCP56 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BCP56_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
支持信息 (2)
| 名称/描述 | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
| Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English] | 30 Sep 2013 |
Design Support
- Letter Symbols - Transistors; General (REV 0.1) PDF LSYMTRA_1 5/7/1999
SPICE
- BCP56 SPICE model (REV 1.4) prm BCP56 7/22/2012
订购信息
| 型号 | 状态 | Package version | Package name | 大小 (mm) | Ptot (mW) | Complement | IC [max] (mA) | Polarity | IC max (mA) | Ptot [max] (mW) | hFE max | VCEO [max] (V) | fT [min] (MHz) | hFE [max] | hFE [min] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BCP56/ZL | Active | SOT223 | SC-73 | 6.5 x 3.5 x 1.65 | |||||||||||
| BCP56 | Active | SOT223 | SC-73 | 6.5 x 3.5 x 1.65 | BCP53 | 1000 | NPN | 1350 | 80 | 180 | 250 | 40 | |||
| BCP56/A | No Longer Manufactured | SOT223 | SC-73 | 6.5 x 3.5 x 1.65 | |||||||||||
| BCP56/R | No Longer Manufactured | SOT223 | SC-73 | 6.5 x 3.5 x 1.65 |
封装环保信息
| 产品编号 | 封装说明 | Outline Version | 回流/波峰焊接 | 包装 | 产品状态 | 部件编号订购码 (12NC) | Marking | 化学成分 | RoHS / 无铅 / RHF | 无铅转换日期 | EFR | IFR(FIT) | MTBF（小时） | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BCP56 | | SOT223 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 7" Q1/T1 | Active | BCP56,115 (9339 172 40115) | BCP56 | BCP56 |    | week 34, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
| Reel 11¼" Q1/T1 in LargePack | Active | BCP56F (9339 172 40135) | BCP56 | BCP56 | 153.0 | 0.71 | 1.41E9 | ||||||||
| BCP56/ZL | | SOT223 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 11¼" Q1/T1 in LargePack | Active | BCP56/ZLF (9340 707 66135) | Standard Marking | BCP56/ZL | 153.0 | 0.71 | 1.41E9 | ||||
| Reel 7" Q1/T1 | Active | BCP56/ZLX (9340 707 66115) | Standard Marking | BCP56/ZL | 153.0 | 0.71 | 1.41E9 |
- Increased circuit efficiency, less required board space and saved money by replacing power transistors with low VCEsat... BCX56-16
- Medium-power general-purpose transistors BSR43
- BCP56 NXP Product Quality BCP56
- BCP56 NXP® Product Reliability BCP56
- Letter Symbols - Transistors; General PEMD16
- BCP56 SPICE model BCP56_BCX56_BC56PA
- plastic surface-mounted package with increased heatsink; 4 leads BUK7880-55A
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Tape reel SMD; standard product orientation 12NC ending 135 BUK7880-55
- Tape reel SMD; standard product orientation 12NC ending 115 BUK7880-55A
- BLT81
