BCP69-16: 20 V，2 A PNP中等功率晶体管 _ BDTIC 中国领先电子元器件代理商

BCP69-16: 20 V，2 A PNP中等功率晶体管

PNP中等功率晶体管，采用SOT223表面贴装器件(SMD)塑料封装。NPN补充产品：BCP68。

BCP69-16: 产品结构框图

BCP69-16: 应用结构框图

SOT223

数据手册 (1)

名称/描述	Modified Date
20 V, 2 A PNP medium power transistors (REV 7.1) PDF (253.0 kB) BCP69_BC869_BC69PA [English]	20 Oct 2011

手册 (1)

名称/描述	Modified Date
Medium-power general-purpose transistors (REV 1.0) PDF (892.0 kB) 75017660 [English]	26 May 2015

封装信息 (1)

名称/描述	Modified Date
plastic surface-mounted package with increased heatsink; 4 leads (REV 1.0) PDF (198.0 kB) SOT223 [English]	08 Feb 2016

包装 (2)

名称/描述	Modified Date
Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (189.0 kB) SOT223_115 [English]	07 Nov 2012
Tape reel SMD; standard product orientation 12NC ending 135 (REV 1.0) PDF (189.0 kB) SOT223_135 [English]	07 Nov 2012

可靠性与质量信息 (2)

名称/描述	Modified Date
BCP69-16 NXP Product Quality (REV 1.2) PDF (74.0 kB) BCP69-16_NXP_PRODUCT_QUALITY [English]	31 Jan 2015
BCP69-16 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BCP69-16_NXP_PRODUCT_RELIABILITY [English]	31 Jan 2015

支持信息 (2)

名称/描述	Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]	30 Sep 2013
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English]	30 Sep 2013

Design Support

Letter Symbols - Transistors; General (REV 0.1) PDF LSYMTRA_1 5/7/1999
Power Derating Curves for SMDs; General (REV 0.1) PDF DERATSMD_1 5/7/1999

SPICE

BCP69-16 SPICE model (REV 1.4) prm BCP69-16 7/22/2012

软件

BCP69_1_2 (REV 0.1) olb BCP69_1_2 11/21/2008

订购信息

型号	状态	Package version	Package name	大小 (mm)	P_tot (mW)	Complement	I_C [max] (mA)	I_C max (mA)	Polarity	P_tot [max] (mW)	V_CEO [max] (V)	hFE max	f_T [min] (MHz)	h_FE [max]	h_FE [min]
BCP69-16/ZL	Active	SOT223	SC-73	6.5 x 3.5 x 1.65
BCP69-16	Active	SOT223	SC-73	6.5 x 3.5 x 1.65		BCP68-16	1000		PNP	1350	20		140	250	100
BCP69-16/A	No Longer Manufactured	SOT223	SC-73	6.5 x 3.5 x 1.65
BCP69-16/G	No Longer Manufactured	SOT223	SC-73	6.5 x 3.5 x 1.65

封装环保信息

产品编号	封装说明	Outline Version	回流/波峰焊接	包装	产品状态	部件编号订购码 (12NC)	Marking	化学成分	RoHS / 无铅 / RHF	无铅转换日期	EFR	IFR(FIT)	MTBF（小时）	MSL	MSL LF
BCP69-16		SOT223	Reflow_Soldering_Profile Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile	Reel 7" Q1/T1	Active	BCP69-16,115 (9340 094 30115)	BCP69/16	BCP69-16		week 34, 2003	153.0	0.71	1.41E9	1	1
BCP69-16		SOT223		Reel 11¼" Q1/T1 in LargePack	Active	BCP69-16F (9340 094 30135)	BCP69/16	BCP69-16			153.0	0.71	1.41E9
BCP69-16/ZL		SOT223	Reflow_Soldering_Profile Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile	Reel 11¼" Q1/T1 in LargePack	Active	BCP69-16/ZLF (9340 707 67135)	Standard Marking	BCP69-16/ZL			153.0	0.71	1.41E9
BCP69-16/ZL		SOT223		Reel 7" Q1/T1	Active	BCP69-16/ZLX (9340 707 67115)	Standard Marking	BCP69-16/ZL			153.0	0.71	1.41E9

20 V, 2 A PNP medium power transistors BCP69-25

Medium-power general-purpose transistors BSR43

BCP69-16 NXP Product Quality BCP69-16

BCP69-16 NXP® Product Reliability BCP69-16

Letter Symbols - Transistors; General PEMD16

Power Derating Curves for SMDs; General BST62

BCP69-16 SPICE model BCP69-16

BCP69_1_2 BCP69-25

plastic surface-mounted package with increased heatsink; 4 leads BUK7880-55A

Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20

Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20

Tape reel SMD; standard product orientation 12NC ending 135 BUK7880-55

Tape reel SMD; standard product orientation 12NC ending 115 BUK7880-55A

PBHV9115Z

PBHV9115Z

BLT81

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