BCV26: PNP达林顿晶体管
PNP达林顿晶体管，采用SOT23塑料封装。NPN补充产品：BCV27和BCV47。
SOT023
数据手册 (1)
| 名称/描述 | Modified Date |
|---|---|
| PNP Darlington transistors (REV 5.0) PDF (116.0 kB) BCV26_BCV46 [English] | 13 Jan 2004 |
封装信息 (1)
| 名称/描述 | Modified Date |
|---|---|
| plastic surface-mounted package; 3 leads (REV 1.0) PDF (213.0 kB) SOT23 [English] | 08 Feb 2016 |
包装 (2)
| 名称/描述 | Modified Date |
|---|---|
| Tape reel SMD; standard product orientation 12NC ending 235 (REV 2.0) PDF (199.0 kB) SOT23_235 [English] | 05 Feb 2013 |
| Tape reel SMD; standard product orientation 12NC ending 215 (REV 1.0) PDF (202.0 kB) SOT23_215 [English] | 16 Nov 2012 |
可靠性与质量信息 (2)
| 名称/描述 | Modified Date |
|---|---|
| BCV26 NXP Product Quality (REV 1.2) PDF (74.0 kB) BCV26_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BCV26 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BCV26_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
支持信息 (2)
| 名称/描述 | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
| Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English] | 30 Sep 2013 |
Design Support
- Letter Symbols - Transistors; General (REV 0.1) PDF LSYMTRA_1 5/7/1999
SPICE
- BCV26 SPICE model (REV 1.4) prm BCV26 7/22/2012
订购信息
| 型号 | 状态 | Package version | Package name | 大小 (mm) | Complement | Ptot (mW) | VCEO [max] (V) | IC [max] (mA) | Configuration | Polarity | IC max (mA) | Ptot [max] (mW) | hFE max | fT [min] (MHz) | hFE [max] | hFE [min] | VCES [max] (V) | fr [min] (MHz) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BCV26 | Active | SOT23 | TO-236AB | 2.9 x 1.3 x 1 | 250 | -30 | -500 | 1 | PNP | 250 | 220 | >20000 | 20000 | 30 |
封装环保信息
| 产品编号 | 封装说明 | Outline Version | 回流/波峰焊接 | 包装 | 产品状态 | 部件编号订购码 (12NC) | Marking | 化学成分 | RoHS / 无铅 / RHF | 无铅转换日期 | EFR | IFR(FIT) | MTBF（小时） | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BCV26 | | SOT23 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 11" Q3/T4, LargePack | Active | BCV26,235 (9338 062 10235) | FD% | BCV26 |    | week 34, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
| Reel 7" Q3/T4 | Active | BCV26,215 (9338 062 10215) | FD% | BCV26 | | week 34, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
- BCV26 NXP Product Quality BCV26
- BCV26 NXP® Product Reliability BCV26
- Letter Symbols - Transistors; General PEMD16
- BCV26 SPICE model BCV26_BCV46
- plastic surface-mounted package; 3 leads BSS84AK
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Tape reel SMD; standard product orientation 12NC ending 235 BSS84AK
- Tape reel SMD; standard product orientation 12NC ending 215 BSS84AK
- PMBFJ309
