BST50; BST51; BST52: NPN达林顿晶体管
NPN达林顿晶体管，采用SOT89塑料封装。
PNP补充产品：BST60、BST61和BST62。
BST50_BST51_BST52: 产品结构框图
BST50_BST51_BST52: 应用结构框图
SOT089
数据手册 (1)
| 名称/描述 | Modified Date |
|---|---|
| NPN Darlington transistors (REV 5.0) PDF (124.0 kB) BST50_51_52 [English] | 09 Dec 2004 |
封装信息 (1)
| 名称/描述 | Modified Date |
|---|---|
| plastic surface-mounted package; die pad for good heat transfer; 3 leads (REV 1.0) PDF (193.0 kB) SOT89 [English] | 08 Feb 2016 |
包装 (2)
| 名称/描述 | Modified Date |
|---|---|
| Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (178.0 kB) SOT89_115 [English] | 28 Nov 2012 |
| Tape reel SMD; standard product orientation 12NC ending 135 (REV 1.0) PDF (178.0 kB) SOT89_135 [English] | 28 Nov 2012 |
可靠性与质量信息 (6)
| 名称/描述 | Modified Date |
|---|---|
| BST50 NXP Product Quality (REV 1.2) PDF (74.0 kB) BST50_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BST50 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BST50_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
| BST51 NXP® Product Quality (REV 1.1) PDF (74.0 kB) BST51_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BST51 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BST51_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
| BST52 NXP Product Quality (REV 1.2) PDF (74.0 kB) BST52_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BST52 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BST52_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
Design Support
- Letter Symbols - Transistors; General (REV 0.1) PDF LSYMTRA_1 5/7/1999
- Power Derating Curves for SMDs; General (REV 0.1) PDF DERATSMD_1 5/7/1999
SPICE
- BST50 SPICE model (REV 1.4) prm BST50 7/22/2012
- BST51 SPICE model (REV 1.4) prm BST51 7/22/2012
- BST52 SPICE model (REV 1.4) prm BST52 7/22/2012
订购信息
| 型号 | 状态 |
|---|---|
| BST51 | Active |
| BST52 | Active |
| BST50 | Active |
封装环保信息
| 产品编号 | 封装说明 | Outline Version | 回流/波峰焊接 | 包装 | 产品状态 | 部件编号订购码 (12NC) | Marking | 化学成分 | RoHS / 无铅 / RHF | 无铅转换日期 | EFR | IFR(FIT) | MTBF（小时） | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BST51 | | SOT89 | Reel 11¼" Q1/T1 in LargePack | Active | BST51,135 (9336 442 60135) | AS2 | BST51 |    | week 28, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 | |
| Reel 7" Q1/T1 | Active | BST51,115 (9336 442 60115) | AS2 | BST51 | | week 28, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 | ||||
| BST52 | | SOT89 | Reel 11¼" Q1/T1 in LargePack | Active | BST52,135 (9336 442 70135) | AS3 | BST52 | | week 28, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 | |
| Reel 7" Q1/T1 | Active | BST52,115 (9336 442 70115) | AS3 | BST52 | | week 28, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 | ||||
| BST50 | | SOT89 | Reel 7" Q1/T1 | Active | BST50,115 (9336 442 50115) | AS1 | BST50 | | week 28, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
- BST50 NXP Product Quality BST50
- BST50 NXP® Product Reliability BST50
- BST51 NXP® Product Quality BST51
- BST51 NXP® Product Reliability BST51
- BST52 NXP Product Quality BST52
- BST52 NXP® Product Reliability BST52
- Letter Symbols - Transistors; General PEMD16
- Power Derating Curves for SMDs; General BST62
- BST50 SPICE model BST50_BST51_BST52
- BST51 SPICE model BST51
- BST52 SPICE model BST52
- Tape reel SMD; standard product orientation 12NC ending 135 BZV49-C4V3
- plastic surface-mounted package; die pad for good heat transfer; 3 leads BZV49-C9V1
- Tape reel SMD; standard product orientation 12NC ending 115 BZV49-C9V1
- BZV49_SERIES
- BST50_BST51_BST52
- BFU590Q
