BZA800A-series: 四倍ESD瞬态电压抑制器
单芯片瞬态电压抑制器二极管采用5引脚SOT353 (SC-88A)封装，可提供4位宽度的ESD瞬态抑制。
BZA800A_SERIES: 产品结构框图
Outline 3d SOT353
数据手册 (1)
| 名称/描述 | Modified Date |
|---|---|
| Quadruple ESD transient voltage suppressor (REV 3.0) PDF (171.0 kB) BZA800A_SERIES [English] | 25 Sep 2000 |
封装信息 (1)
| 名称/描述 | Modified Date |
|---|---|
| plastic surface-mounted package; 5 leads (REV 1.0) PDF (245.0 kB) SOT353 [English] | 08 Feb 2016 |
包装 (1)
| 名称/描述 | Modified Date |
|---|---|
| Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (191.0 kB) SOT353_115 [English] | 16 Nov 2012 |
可靠性与质量信息 (4)
| 名称/描述 | Modified Date |
|---|---|
| BZA856A NXP Product Quality (REV 1.2) PDF (74.0 kB) BZA856A_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BZA856A NXP® Product Reliability (REV 1.1) PDF (83.0 kB) BZA856A_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
| BZA862A NXP® Product Reliability (REV 1.0) PDF (88.0 kB) BZA862A_NXP_PRODUCT_RELIABILITY [English] | 16 Jul 2014 |
| BZA862A NXP® Product Quality (REV 1.0) PDF (16.0 kB) BZA862A_NXP_PRODUCT_QUALITY [English] | 22 Apr 2014 |
支持信息 (3)
| 名称/描述 | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
| Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English] | 30 Sep 2013 |
| MAR_SOT353 Topmark (REV 1.0) PDF (103.0 kB) MAR_SOT353 [English] | 03 Jun 2013 |
SPICE
- BZA856A SPICE model (REV 1.4) prm BZA856A 7/22/2012
- BZA862A SPICE model (REV 1.4) prm BZA862A 7/22/2012
订购信息
| 型号 | 状态 |
|---|---|
| BZA856A | Active |
| BZA862A | No Longer Manufactured |
封装环保信息
| 产品编号 | 封装说明 | Outline Version | 回流/波峰焊接 | 包装 | 产品状态 | 部件编号订购码 (12NC) | Marking | 化学成分 | RoHS / 无铅 / RHF | 无铅转换日期 | EFR | IFR(FIT) | MTBF（小时） | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BZA862A | | SOT353 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 7" Q1/T1 | Withdrawn | BZA862A,115 (9340 560 43115) | Z2% |    | week 31, 2003 | 117.0 | 0.54 | 1.85E9 | 1 | 1 | |
| BZA856A | | SOT353 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 7" Q1/T1 | Active | BZA856A,115 (9340 560 32115) | Z1% | BZA856A | | week 31, 2003 | 117.0 | 0.54 | 1.85E9 | 1 | 1 |
- BZA856A NXP Product Quality bza856a
- BZA856A NXP® Product Reliability bza856a
- BZA862A NXP® Product Reliability bza862a
- BZA862A NXP® Product Quality bza862a
- MAR_SOT353 Topmark 74LVC1G17_Q100
- BZA856A SPICE model BZA856A
- BZA862A SPICE model BZA800A_SERIES
- plastic surface-mounted package; 5 leads NX3L1G66GW-Q100
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Tape reel SMD; standard product orientation 12NC ending 115 pesd5v0v4ug
- BZA800AVL_SERIES
- NCX2202
