BZT52H-C47: 采用SOD123F封装的单倍齐纳二极管

通用齐纳二极管,采用SOD123F小型扁平引脚表面贴装器件(SMD)塑料封装。

BZT52H-C47: 产品结构框图
BZT52H-C47: 应用结构框图
sod123f_3d
数据手册 (1)
名称/描述Modified Date
Single Zener diodes in a SOD123F package (REV 3.0) PDF (118.0 kB) BZT52H_SER [English]09 Dec 2010
选型工具指南 (1)
名称/描述Modified Date
Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 [English]17 Feb 2016
封装信息 (1)
名称/描述Modified Date
plastic surface-mounted package; 2 leads (REV 1.0) PDF (172.0 kB) SOD123F [English]08 Feb 2016
包装 (1)
名称/描述Modified Date
Tape reel; standard product orientation 12NC ending 115 (REV 1.0) PDF (183.0 kB) SOD123F_115 [English]07 Nov 2012
可靠性与质量信息 (2)
名称/描述Modified Date
BZT52H-C47 NXP® Product Reliability (REV 1.1) PDF (83.0 kB) BZT52H-C47 [English]31 Jan 2015
BZT52H-C47 NXP Product Quality (REV 1.2) PDF (74.0 kB) BZT52H-C47_NXP_PRODUCT_QUALITY [English]31 Jan 2015
支持信息 (1)
名称/描述Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
SPICE
订购信息
型号状态Package versionPackage name大小 (mm)PZSM (W)VZ nom (V)ConfigurationVZ max. (V)IF max (mA)VZ min. (V)Tolerance +/-Ptot (mW)
BZT52H-C47ActiveSOD123FSOD123F2.6 x 1.6 x 1.14047single50250445%830
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期EFRIFR(FIT)MTBF(小时)MSLMSL LF
BZT52H-C47SOD123FReflow_Soldering_ProfileReel 7" Q1/T1ActiveBZT52H-C47,115 (9340 594 19115)C1BZT52H-C47Always Pb-free117.00.541.85E911
Single Zener diodes in a SOD123F package BZT52H-C47
Discretes Semiconductors Selection Guide 2016 BUK7M12-60E
BZT52H-C47 NXP® Product Reliability BZT52H-C47
BZT52H-C47 NXP Product Quality BZT52H-C47
BZT52H-C47 SPICE model BZT52H-C47
plastic surface-mounted package; 2 leads BAT54H
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Tape reel; standard product orientation 12NC ending 115 BAT54H
1PSXSB17
NZH_SERIES