NE1617ADS: 用于微处理器系统的温度监控器
NE1617A是一款精确的双通道温度监控器。该器件可测量自身温度，以及远程传感器的温度。远程传感器是一个连接二极管的晶体管。它可以是分立式NPN/PNP（如2N3904/2N3906），也可以是内置在另一个芯片中并且连接二极管的PNP（如某些Intel微处理器）。
远程和本地传感器的温度数据存储在寄存器中，可通过双线式SMBus读取。温度数据的更新速率可以通过SMBus进行编程（平均电源电流取决于更新速率——速率越高，电流越大）。
除了以编程速率更新温度数据的正常工作模式，另外还有可以强迫更新温度数据的单次模式。
此外，还提供警报功能，可感测过温或欠温条件。该警报的跳变点同样可以进行编程。
该器件可以采用九个地址中的一个（由两个地址针脚确定），因此SMBus上最多可连接九个NE1617A器件。
还能将其置于待机模式下（以便节能）。可以通过软件（通过SMBus）或硬件（通过STBY针脚）实现。
sot519-1_3d
数据手册 (1)
| 名称/描述 | Modified Date |
|---|---|
| Temperature monitor for microprocessor systems (REV 5.0) PDF (305.0 kB) NE1617A [English] | 20 Mar 2012 |
应用说明 (3)
| 名称/描述 | Modified Date |
|---|---|
| Level shifting techniques in I2C-bus design (REV 1.0) PDF (52.0 kB) AN10441 [English] | 20 Jun 2007 |
| Digital temperature sensor accuracy explained (REV 1.0) PDF (111.0 kB) AN10349 [English] | 09 Aug 2006 |
| I2C manual (REV 1.0) PDF (4.2 MB) AN10216 [English] | 27 Mar 2003 |
用户指南 (3)
| 名称/描述 | Modified Date |
|---|---|
| I2C-bus specification and user manual (REV 6.0) PDF (1.4 MB) UM10204 [English] | 28 Apr 2014 |
| I2C-bus specification and user manual (REV 5.0) PDF (1.6 MB) UM10204_JA [English] | 03 Apr 2013 |
| I2C Demonstration Board 2005-1 Quick Start Guide (REV 1.0) PDF (261.0 kB) UM10206 [English] | 13 Jun 2006 |
手册 (3)
| 名称/描述 | Modified Date |
|---|---|
| NXP® I2C-bus solutions 2014: Smart, simple solutions for the 12 most common design concerns (REV 1.0) PDF (3.5 MB) 75017540 [English] | 01 Aug 2014 |
| Precise thermal monitoring with small, accurate temp sensors; NXP® temperature sensors NE1617A & NE1619 (REV 1.0) PDF (253.0 kB) 75016533 [English] | 01 Aug 2008 |
| Create smarter, more efficient white goods; An industry-leading portfolio of cost-effective, power-saving solutions for... (REV 1.0) PDF (1.1 MB) 75016543 [English] | 01 Jun 2008 |
选型工具指南 (1)
| 名称/描述 | Modified Date |
|---|---|
| I2C-bus temperature sensors; Small, accurate, low-cost sensors for advanced temperature regulation (REV 1.0) PDF (675.0 kB) 75015693 [English] | 01 Nov 2006 |
封装信息 (1)
| 名称/描述 | Modified Date |
|---|---|
| plastic shrink small outline package; 16 leads; body width 3.9 mm; lead pitch 0.635 mm (REV 1.0) PDF (278.0 kB) SOT519-1 [English] | 08 Feb 2016 |
包装 (1)
| 名称/描述 | Modified Date |
|---|---|
| SSOP16; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or J Ordering code... (REV 1.0) PDF (194.0 kB) SOT519-1_118 [English] | 20 Oct 2015 |
支持信息 (2)
| 名称/描述 | Modified Date |
|---|---|
| Footprint for reflow soldering (REV 1.0) PDF (16.0 kB) SSOP-TSSOP-VSO-REFLOW [English] | 08 Oct 2009 |
| Footprint for wave soldering (REV 1.0) PDF (16.0 kB) SSOP-TSSOP-VSO-WAVE [English] | 08 Oct 2009 |
订购信息
| 型号 | 状态 | Package version | Remarks | Standby current (uA) | Operating Temperature (Cel) | I2C-bus controlled | Part type | Accuracy on-chip (±°C) | Operating voltage (VDC) | Assignable addresses | SMBus clock (kHz) | Accuracy remote (±°C) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| NE1617ADS | Active | SOT519-1 | 10 | 0~120 | 3.0~5.5 | 1@+60~100?2@0~125 | 3.0~5.5 | 9 | 100 | 3@+60~100?5@0~125 | ||
| NE1617ADS/G | No Longer Manufactured | SOT519-1 | 10 | 0~120 | 3.0~5.5 | 1@+60~100?2@0~125 | 3.0~5.5 | 9 | 100 | 3@+60~100?5@0~125 | ||
| NE1617ADS/01 | No Longer Manufactured | SOT519-1 | 10 | 0~120 | 3.0~5.5 | 1@+60~100?2@0~125 | 3.0~5.5 | 9 | 100 | 3@+60~100?5@0~125 | ||
| NE1617ADS/CD8458/N | No Longer Manufactured | SOT519-1 | 10 | 0~120 | 3.0~5.5 | 1@+60~100?2@0~125 | 3.0~5.5 | 9 | 100 | 3@+60~100?5@0~125 |
封装环保信息
| 产品编号 | 封装说明 | Outline Version | 回流/波峰焊接 | 包装 | 产品状态 | 部件编号订购码 (12NC) | Marking | 化学成分 | RoHS / 无铅 / RHF | 无铅转换日期 | EFR | IFR(FIT) | MTBF（小时） | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| NE1617ADS | | SOT519-1 | SSOP-TSSOP-VSO-REFLOW
SSOP-TSSOP-VSO-WAVE SSOP-TSSOP-VSO-REFLOW SSOP-TSSOP-VSO-WAVE | Reel 13" Q1/T1 | Active | NE1617ADS,118 (9352 681 19118) | NE1617A | NE1617ADS |    | week 13, 2005 | 0.0 | 3.0 | 3.33E8 | 1 | 1 |
| Bulk Pack | Active | NE1617ADS,112 (9352 681 19112) | NE1617A | NE1617ADS | | week 13, 2005 | 0.0 | 3.0 | 3.33E8 | 1 | 1 |
- Level shifting techniques in I2C-bus design pca9685pw
- Digital temperature sensor accuracy explained se95u
- I2C manual se98apw
- I2C-bus specification and user manual pca9685pw
- I2C-bus specification and user manual pca9685pw
- I2C Demonstration Board 2005-1 Quick Start Guide pca9685pw
- NXP® I2C-bus solutions 2014: Smart, simple solutions for the 12 most common design concerns pca9685pw
- Precise thermal monitoring with small, accurate temp sensors; NXP® temperature sensors NE1617A & NE1619 ne1619ds
- Create smarter, more efficient white goods; An industry-leading portfolio of cost-effective, power-saving solutions for... PMEG6010CE_AUTOMOTIVE
- I2C-bus temperature sensors; Small, accurate, low-cost sensors for advanced temperature regulation se95u
- plastic shrink small outline package; 16 leads; body width 3.9 mm; lead pitch 0.635 mm 74CBTLV3257_Q100
- Footprint for reflow soldering 74HC_T_595_Q100
- SSOP-TSSOP-VSO-WAVE LPC1114FDH28
- SSOP16; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or J Ordering code... 74CBTLV3257_Q100
- NE1617ADS
