NTAG®213, NTAG215 and NTAG216 have been developed by NXP® Semiconductors as standard NFC tag ICs to be used in mass market applications such as retail, gaming and consumer electronics, in combination with NFC devices or NFC compliant Proximity Coupling Devices. NTAG213, NTAG215 and NTAG216 (from now on, generally called NTAG21x) are designed to fully comply to NFC Forum Type 2 Tag and ISO/IEC14443 Type A specifications.
Target applications include Out-of-Home and print media smart advertisement, SoLoMo applications, product authentication, NFC shelf labels, mobile companion tags.
Target use cases include Out-of-Home smart advertisement, product authentication, mobile companion tags, Bluetooth or Wi-Fi pairing, electronic shelf labels and business cards. NTAG21x memory can also be segmented to implement multiple applications at the same time.
Thanks to the high input capacitance, NTAG21x tag ICs are particularly tailored for applications requiring small footprints, without compromise on performance. Small NFC tags can be more easily embedded into e.g. product labels or electronic devices.
The mechanical and electrical specifications of NTAG21x are tailored to meet the requirements of inlay and tag manufacturers.
Communication to NTAG21x can be established only when the IC is connected to an antenna.
When NTAG21x is positioned in the RF field, the high speed RF communication interface allows the transmission of the data with a baud rate of 106 kbit/s.
NTAG21x offers specific features designed to improve integration and user convenience:
NTAG21x IC provides full compliance to the NFC Forum Tag 2 Type technical specification and enables NDEF data structure configurations.
An intelligent anticollision function allows to operate more than one tag in the field simultaneously. The anticollision algorithm selects each tag individually and ensures that the execution of a transaction with a selected tag is performed correctly without interference from another tag in the field.
名称/描述 | Modified Date |
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NFC Forum Type 2 Tag compliant IC with 144/504/888 bytes user memory (REV 3.2) PDF (1.6 MB) NTAG213_215_216 [English] | 03 Jun 2015 |
名称/描述 | Modified Date |
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NTAG® Antenna Design Guide (REV 1.5) ZIP (4.8 MB) AN11276_1_2 [English] | 27 Apr 2016 |
名称/描述 | Modified Date |
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plastic leadless module carrier package; 35 mm wide tape (REV 1.0) PDF (220.0 kB) SOT500-4 [English] | 08 Feb 2016 |
型号 | 状态 | 状态 | 预算报价(不含税)(CNY) | 封装类型和焊端数 | GPIOs | 认证级别 |
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NT2H1611G0DA8 | Active |
产品编号 | 封装说明 | Outline Version | 回流/波峰焊接 | 包装 | 产品状态 | 部件编号订购码 (12NC) | Marking | 化学成分 | RoHS / 无铅 / RHF | 无铅转换日期 | MSL | MSL LF |
---|---|---|---|---|---|---|---|---|---|---|---|---|
NT2H1611G0DA8 | SOT500-4 | Reel 13" Q1/T1 | Active | NT2H1611G0DA8J (9353 046 26118) | Standard Marking | NT2H1611G0DA8 | Always Pb-free | NA | NA |